Current and Future Trends in Microjoining

  • K. I. Johnson
  • S. T. Riches

Abstract

Major developments in microjoining applications for the electronics and miniature fabrication industries are remained including: attachment of active circuits, interconnection of circuits, packaging, package interconnection and transducer and device fabrication. The joining processes employed in the drive to increased miniaturisation, productivity and reliability include adhesives, Si/glass bonding, electrostatic bonding, ultrasonic welding, soldering and miniature arc, resistance and Nd-YAG laser welding.

Keywords

Laser Welding Spot Weld Wire Bonding Very Large Scale Integration Resistance Welding 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Chapman and Hall 1990

Authors and Affiliations

  • K. I. Johnson
    • 1
  • S. T. Riches
    • 1
  1. 1.Welding InstituteUK

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