Current and Future Trends in Microjoining
Major developments in microjoining applications for the electronics and miniature fabrication industries are remained including: attachment of active circuits, interconnection of circuits, packaging, package interconnection and transducer and device fabrication. The joining processes employed in the drive to increased miniaturisation, productivity and reliability include adhesives, Si/glass bonding, electrostatic bonding, ultrasonic welding, soldering and miniature arc, resistance and Nd-YAG laser welding.
KeywordsLaser Welding Spot Weld Wire Bonding Very Large Scale Integration Resistance Welding
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