Thermal Performance in Ecological Korean House

Conference paper
Part of the Lecture Notes in Electrical Engineering book series (LNEE, volume 215)

Abstract

Korean Traditional house made of natural resources with low level thermal properties shows high performance in temperature and humidify control comportable for human. The present investigation is to examine the thermal behaviors of air flows inside the traditional house. The transient numerical experiments are performed along with the different external conditions. Thermal properties of building units have been obtained by the parallel measurements and utilized in the numerical works. Consequently, the details of flows and temperature of air in the houses illustrate the thermal design of the traditional Korean house satisfy the requirements of human living.

Keywords

Humidify Flow patterns CFD Traditional house 

Notes

Acknowledgments

This research is supported by Basic Science Research Program through the NRF (National Research Foundation of Korea) funded by the Ministry of Education, Science and Technology (2010-0021154).

References

  1. 1.
    National Research Institute of Cultural Heritage (2008) The characteristics evaluation of traditional architecture and probability of their application. National Research Institute of Cultural Properties, TokyoGoogle Scholar
  2. 2.
    Architecture, Urban, Research Institute (AURI), Institute of Seoul Studies (ISS) (2008) Hanok building construction technology plan for the promotion of industrial research. Ministry of Land Transport and Maritime Affairs, Bogeumjari pp 129–222Google Scholar
  3. 3.
    Ahn EY, Kim JW (2010) Numerical analysis of air flows inside Koran traditional house. In: Proceedings of the Korea contents association, pp 469–471Google Scholar
  4. 4.
    Kim D, Oh H (2001) A study on changes in the space composition of Each room in Bukchon Hanoi—Focused on Open-Hanoks and publicly purchased Hanoks. J Korean Home Manag Assoc 26(2):115–127Google Scholar
  5. 5.
    Hanamann RJ (1981) Microelectronic device thermal resistance: a format for standardization. In: Proceedings of heat transfer in electronic equipment, pp 39–48Google Scholar
  6. 6.
    Oktay S, Hannemann R, Bar-Cohen A (1986) High heat from a small package. Mech Eng 108(3):36–42Google Scholar
  7. 7.
    Kraus AD, Bar-Cohen A (1983) Thermal analysis and control of equipment. McGraw Hill, New York p 302Google Scholar

Copyright information

© Springer Science+Business Media Dordrecht 2013

Authors and Affiliations

  1. 1.Department of Mechanical EngineeringSunmoon UniversityAsanSouth Korea
  2. 2.Department of Multimedia EngineeringDongguk UniversitySeoulSouth Korea
  3. 3.Department of Information Communication EngineeringHanbat National UniversityYuseong-guSouth Korea

Personalised recommendations