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Multiple-Scale Interface Fracture Analysis for Thin Film/Substrate System Under Temperature Mismatch

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Part of the book series: IUTAM Bookseries (closed) ((IUTAMBOOK,volume 31))

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Abstract

Based on the Wei-Xu model (Int J Plast, 21:2123, 2005), a multiple-scale interface fracture analysis for the thin film/substrate system under temperature mismatch is carried out. The thin film delamination process at the macroscopic scale is analyzed by using the strain gradient plasticity theory. The plastic shielding effects on the interface crack propagation are investigated for both the elastic film/plastic substrate and the plastic film/elastic substrate systems. On the other hand, by presenting a bridging model (equivalent interface K’-field) and by using the Rice-Thomson discrete dislocation model, the microscopic fracture process of the thin film/substrate system is analyzed, and the dislocation shielding effects on interface cracking at the microscale are investigated. The results show that the variation of interface fracture energy has an inverse size effect with respect to the dislocation-free zone size.

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Acknowledgements

The work is supported by National Science Foundations of China through Grants Nos 10721202, 10932011, 90816004.

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Authors and Affiliations

  1. LNM, Institute of Mechanics, Chinese Academy of Sciences, Beijing, 100190, China

    M. Z. Li, H. S. Ma, L. H. Liang & Y. G. Wei

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  1. M. Z. Li
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  2. H. S. Ma
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  3. L. H. Liang
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  4. Y. G. Wei
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Correspondence to Y. G. Wei .

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Editors and Affiliations

  1. , Engineering Science, University of Oxford, Parks Road, Oxford, OX1 3 PJ, United Kingdom

    Alan Cocks

  2. , Mechanics and Aerospace Engineering, Peking University, Beijing, 100871, China, People's Republic

    Jianxiang Wang

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Li, M.Z., Ma, H.S., Liang, L.H., Wei, Y.G. (2013). Multiple-Scale Interface Fracture Analysis for Thin Film/Substrate System Under Temperature Mismatch. In: Cocks, A., Wang, J. (eds) IUTAM Symposium on Surface Effects in the Mechanics of Nanomaterials and Heterostructures. IUTAM Bookseries (closed), vol 31. Springer, Dordrecht. https://doi.org/10.1007/978-94-007-4911-5_12

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  • DOI: https://doi.org/10.1007/978-94-007-4911-5_12

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  • Online ISBN: 978-94-007-4911-5

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