Systematic and Random Variability

Of Measured Results
  • Gustavo Neuberger
  • Gilson Wirth
  • Ricardo Reis
Chapter

Abstract

The total variability observed in the measured data may come from different sources. They may be wafer-to-wafer, die-to-die, intra-die, and may come from systematic or random sources.

References

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    BONING, D. S.; CHUNG, J. E. Statistical metrology: understanding spatial variation in semiconductor manufacturing. In: Microelectronic Manufacturing Yield, Reliability and Failure Analysis II. Proceedings… Bellingham, Washington: SPIE, 2006. p. 16–26.Google Scholar
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    FRIEDBERG, P.; CHEUNG, W.; SPANOS, C. J. Spatial Modeling of Micron-Scale Gate Length Variation. In: Data Analysis and Modeling for Process Control III, 2006. Proceedings… [S.l.]: SPIE, 2006. p. 61550C.1-61550C.12.Google Scholar
  3. 45.
    STINE, B. E.; BONING, D. S.; CHUNG, J. E. Analysis and Decomposition of Spatial Variation in Integrated Circuit Processes and Devices. IEEE Transactions on Semiconductor Manufacturing, New York, v. 10, n. 1, p. 24–41, Feb. 1997.Google Scholar

Copyright information

© Springer Science+Business Media Dordrecht 2014

Authors and Affiliations

  • Gustavo Neuberger
    • 1
  • Gilson Wirth
    • 2
  • Ricardo Reis
    • 3
  1. 1.Instituto Federal de EducaçãoCiência e Tecnologia do Rio Grande do Sul(IFRS) CampusCanoas CanoasBrazil
  2. 2.Depto de Eng ElétricaUniversidade Federal do Rio Grande do Sul (UFRGS)Porto AlegreBrazil
  3. 3.Instituto de InformáticaUniversidade Federal do Rio Grande do Sul (UFRGS)Porto AlegreBrazil

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