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This chapter presents the integration of a 60GHz amplifier and an antenna in a printed circuit-board (PCB) technology. The materials that are used for the realization of the PCB package are discussed. The implementation of flip-chip interconnection between the amplifier and the PCB is presented. The measurement results of the flip-chip integration are presented and discussed.
KeywordsRadiation Pattern Package Prototype Anisotropic Conductive Adhesive Large Thermal Expansion Gold Bump
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