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Flip-Chip Integration

  • Yikun YuEmail author
  • Peter G. M. Baltus
  • Arthur H. M. van Roermund
Chapter
  • 1.5k Downloads
Part of the Analog Circuits and Signal Processing book series (ACSP, volume 1)

Abstract

This chapter presents the integration of a 60GHz amplifier and an antenna in a printed circuit-board (PCB) technology. The materials that are used for the realization of the PCB package are discussed. The implementation of flip-chip interconnection between the amplifier and the PCB is presented. The measurement results of the flip-chip integration are presented and discussed.

Keywords

Radiation Pattern Package Prototype Anisotropic Conductive Adhesive Large Thermal Expansion Gold Bump 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media B.V. 2011

Authors and Affiliations

  • Yikun Yu
    • 1
    Email author
  • Peter G. M. Baltus
    • 1
  • Arthur H. M. van Roermund
    • 1
  1. 1.Electrical Engineering, Mixed-signal Microelectronics GroupTechnical University EindhovenEindhovenThe Netherlands

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