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Measurements for Mechanical Reliability of Thin Films

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Security and Reliability of Damaged Structures and Defective Materials

Abstract

This paper reviews techniques for measurement of basic mechanical properties of thin films. Emphasis is placed on the adaptations needed to prepare, handle, and characterize thin films, and on adaptations of fracture mechanics for adhesion strength. The paper also describes a recent development, the use of electrical current as a controlled means of applying thermo-mechanical stresses to electrical conductors to characterize their fatigue behavior.

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Author information

Authors and Affiliations

  1. Materials Reliability Division, National Institute of Standards and Technology, Boulder, Colorado

    David T. Read

  2. Department of Mechanical Engineering, University of South Florida, Tampa, Florida

    Alex A. Volinsky

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  1. David T. Read
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  2. Alex A. Volinsky
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Editor information

Editors and Affiliations

  1. Laboratoire de Fiabilité Mécanique (LFM), Université Paul Verlaine – Metz – ENIM, Metz, 57045, France

    Guy Pluvinage

  2. University of Belgrade, Faculty of Mechanical Engineering, Kraljice Marije 16, Belgrade, 11000, Serbia

    Aleksandar Sedmak

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Read, D.T., Volinsky, A.A. (2009). Measurements for Mechanical Reliability of Thin Films. In: Pluvinage, G., Sedmak, A. (eds) Security and Reliability of Damaged Structures and Defective Materials. NATO Science for Peace and Security Series C: Environmental Security. Springer, Dordrecht. https://doi.org/10.1007/978-90-481-2792-4_16

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  • DOI: https://doi.org/10.1007/978-90-481-2792-4_16

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-90-481-2791-7

  • Online ISBN: 978-90-481-2792-4

  • eBook Packages: EngineeringEngineering (R0)

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