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808 nm VCSELs Temperature Characteristic Study

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Wireless Communications, Networking and Applications

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 348))

Abstract

Temperature characteristic is one of the important characteristics in vertical-cavity surface-emitting lasers (VCSELs), and it directly effects on the photo-electricity characteristics of semiconductor lasers. So a new electrode structure VCSEL is proposed and demonstrated. In order to study temperature variation of the 808 nm VCSEL, opto-electricity is measured by changing the temperature of heat sink. The testing results show that new electrode structure VCSEL characteristic is better than the traditional structure ones.

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References

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Acknowledgments

This work was supported by the National Natural Science Foundation of China (Grant No. 11474038), the Project fund of State Key Laboratory (Grant No. 9140C31010214C3100003) and Science and Technology Development Project of Jilin Province (Grant No. 20130521014JH).

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Authors and Affiliations

  1. National Key Laboratory on High Power Semiconductor Lasers, Changchun University of Science and Technology, Changchun, 130022, China

    Yuan Feng, Dawei Feng, Pengcheng Liu, Xiaohui Ma, Yongqin Hao, Guojun Liu, Changling Yan, Yong Wang, Zaijin Li & Yang Li

  2. Guangdong College of Business and Technology, Guangdong, China

    Yuan Feng & Dawei Feng

Authors
  1. Yuan Feng
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  2. Dawei Feng
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  3. Pengcheng Liu
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  4. Xiaohui Ma
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  5. Yongqin Hao
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  6. Guojun Liu
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  7. Changling Yan
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  8. Yong Wang
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  9. Zaijin Li
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  10. Yang Li
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Corresponding author

Correspondence to Yuan Feng .

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Editors and Affiliations

  1. Department of Computer Systems Technology, North Carolina A&T State University, Greensboro, North Carolina, USA

    Qing-An Zeng

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© 2016 Springer India

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Cite this paper

Feng, Y. et al. (2016). 808 nm VCSELs Temperature Characteristic Study. In: Zeng, QA. (eds) Wireless Communications, Networking and Applications. Lecture Notes in Electrical Engineering, vol 348. Springer, New Delhi. https://doi.org/10.1007/978-81-322-2580-5_72

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  • DOI: https://doi.org/10.1007/978-81-322-2580-5_72

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  • Publisher Name: Springer, New Delhi

  • Print ISBN: 978-81-322-2579-9

  • Online ISBN: 978-81-322-2580-5

  • eBook Packages: EngineeringEngineering (R0)

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