Skip to main content

Interactive VLSI Chip Floor Design Using Color Graphics

  • Conference paper
Book cover Frontiers in Computer Graphics

Abstract

In a hierarchical VLSI design, the block-level layout design is called ‘chip floor plan’. This paper presents a semi-automatic VLSI chip floor plan program CHAMP, which utilizes a color graphic terminal to the fullest. It has an automatic initial placement and semi-automatic block packing procedures. In the chip floor plan problem, because of the variety of block sizes and shapes, it is very difficult to minimize the chip area by only an automatic process using a computer. Consequently, in most cases, the optimum solution is not obtained without the help of a human designer. To facilitate the manual optimization process, CHAMP is provided with a set of interactive commands using a color graphic terminal. In this paper, chip floor plan program CHAMP is described, in which its interactive facilities are emphasized, and the application results are discussed.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 39.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 54.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. C. S. Horng and M. Lie, “An automation/interactive layout planning system for arbitrarily-sized rectangular building blocks,” Proc. 18th Design Automation Conference, pp. 293-300, June 1981.

    Google Scholar 

  2. R.H.J.M. Otten, “Automatic floorplan design,” Proc. 19th Design Automation Conference, pp. 261-267, June 1982.

    Google Scholar 

  3. W. R. Heller, G. Sorkin and K. Maling, “The planar package planner for system designer,” Proc. 19th Design Automation Conference, pp. 253-260, June 1982.

    Google Scholar 

  4. K. Maling, S. H. Mueller and W. R. Heller, “On finding most optimal rectangular package plans,” Proc. 19th design automation Conference, pp. 663-670, June 1982.

    Google Scholar 

  5. A. Leblond, “CAF: A computer-assisted floorplanning tool,” Proc. 20th Design Automation Conference, pp. 747-753, June 1983.

    Google Scholar 

  6. T. Sudo, T. Ohtsuki and S. Goto, “CAD systems for VLSI in Japan,” Proc. of IEEE, Vol. 71, No. 1, pp. 129–143 (January 1983).

    Article  Google Scholar 

  7. T. Adachi, H. Kitazawa, M. Nagatani and T. Sudo, “Hierarchical top down layout design method for VLSI chip,” Proc. of 19th Design Automation Conference, pp. 785-791 (June 1982).

    Google Scholar 

  8. K. Ueda, “Placement algorithm for logic modules,” Electron. Lett., 10, 10, pp. 206–208 (1974).

    Article  Google Scholar 

  9. K. Ueda and H. Kitazawa, “Algorithm for VLSI chip floor plan,” Electron. Lett., 19, 3, pp. 77–78 (1983).

    Article  Google Scholar 

  10. H. Kitazawa and K. Ueda, “Chip area estimation method for VLSI chip floor plan,” Electron. Lett., 20, 3, pp. 137–139 (1984).

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 1985 Springer-Verlag Tokyo

About this paper

Cite this paper

Ueda, K., Kitazawa, H., Harada, I. (1985). Interactive VLSI Chip Floor Design Using Color Graphics. In: Kunii, T.L. (eds) Frontiers in Computer Graphics. Springer, Tokyo. https://doi.org/10.1007/978-4-431-68025-3_21

Download citation

  • DOI: https://doi.org/10.1007/978-4-431-68025-3_21

  • Publisher Name: Springer, Tokyo

  • Print ISBN: 978-4-431-68027-7

  • Online ISBN: 978-4-431-68025-3

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics