Abstract
The semiconductor manufacturing engineer is often faced with the problems of process integration, equipment control, parametric yield diagnosis, process centering, worst-case design, and device parameter extraction. These problems require the use of technology CAD (TCAD) tools across a spectrum of speed and accuracy. We have developed a specialized TCAD framework to integrate the required tools and auxiliary software into a system that is convenient for everyday use. The initial work was embodied in the PREDITOR system, and has now evolved into pdFab, a commercial product. In this paper, we will describe the PREDITOR and pdFab systems, and show experimental results of using pdFab on industrial problems.
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References
A. Wong (ed.). Semiconductor Wafer Representation Architecture Document V1.0. Technical Report CFI Document TCAD-91-G-1, CAD Framework Initiative, July, 1992.
D. S. Boning and D. A. Antoniadis. MASTIF - A Workstation Approach to Fabrication Process Design. IEEE International Conference on Computer-Aided Design (ICCAD) Digest of Technical Papers, pages 280–282. November, 1985.
D. S. Boning, ed. Technology CAD Frametivork Architecture. Technical Report S90013, Semiconductor Research Corporation, May, 1990.
D. S. Boning, M. L. Ileytens and A. S. Wong. The Intertool Profile Interchange Format: An Object-Oriented Approach. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 10 (9): 1150–1156, September, 1990.
J. B. Brockman and S. W. Director. The Hercules CAD Task Management System. IEEE International Conference on Computer-Aided Design (ICCAD) Digest of Technical Papers, pages 254257. IEEE, November, 1991.
S. Cl. Duvall. An Interchange Format for Process and Device Simulation. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 7 (7): 741–754, July, 1988.
D. Collins and A. Strojwas. A Methodology for the Development of Semiconductor Equipment/ Process Models. Symposium on Automated Integrated Circuits Manufacturing. Proceedings of Fifth Symposium(90–3):66–77, March, 1990.
F. Fasching, C. Fischer, S. Selberherr, II. Stippel, W. Tuppa, and H. Read. A PIF Implementation for TCAD Purposes. Simulation of Semiconductor Devices and Processes (SISDEP) Vol. 4, pages 477–482. September, 1991.
M.D. Giles and S. R. Nassif. Unified System for Process and Device Simulation: Proposed Database Inter,- face Format. Technical Report, ATT Bell Laboratories, Allentown, PA, June, 1988.
D. A. Hansen, J. K. Kibarian, H. S. Chen, and D. B. Kao. The Use of Technology CAD in MMCMOS Process Development–Manufacturability and SPICE Model Prediction. TOAD Workshop, National Semiconductor Corporation. May 26–27, 1993.
C. 1-legarty, T. Feudei, N. Hitschfeld, R. Ryter, N. Strecker, M. Westermann, and W. Fichtner. An Approach to Three-Dimensional VLSI Process Simulation. Proceedings of the 178nd Meeting of the Electrochemical Society,pages 565–575. May, 1993.
C. P. Ho, J. D. Plummer, S. E. Hansen, and R. W. Dutton. VLSI Process Modeling - SUPREM-III. IEEE Transactions on Electron Devices. ED-30(11):1438–1453, November, 1983.
J. Hogan. DAC92 Panel - Manufacturing Interface. June, 1992.
M. E. Law and R. W. Dutton. Verification of Analytic Point Defect Models Using SUPREM-IV. IEEE “Transactions on Computer-Aided Design of Integrated Circuits and Systems. 7 (2): 181–190, February, 1988.
K. Lee and A. Neureuther. SIMPL 2: (Simulated Profiles from the Layout–Version 2). IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 7 (2): 160–167, February, 1988.
P. Lloyd, H. K. Dirks, E. J. Prendergast, and K. Singhal. Technology CAD for Competitive Products. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 9 (1): 1209–1216, November, 1990.
K. Lucas and A. J. Strojwas. A New Vector 2D Photolithography Simulation Tool. International Electron Devices Meeting Technical Digest, pages 7.5.1–7.5. 4. IEEE, December, 1992.
W. Maly, A. J. Strojwas, and S. W. Director. Fabrication Based Statistical Design of Monolithic ICs. Proceedings of the IEEE International Symposium on Circuits and Systems, pages 135–138. April, 1981.
W. Maly and A. J. S[rojwas. Statistical Simulation of the IC Manufacturing Process. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 1(3), July, 1982.
J. Mar, K. Bhargavan, S. G. Duvall, R. Firestone, D. J. Lucey, S. N. Nandgaonkar, S. Wu, K. Yu, and F. Zarbakhsh. EASE - An Application-Based CAD System for Process Design. IEEE Transactions on Computer-Aided Design of integrated Circuits and Systems. CAD-6(6):1032–1038, November, 1987.
M. Mcllrath (ed.). Current Concepts in Semiconductor Process Representation V0.2. Technical Report CFI Document (TCAD-91-T-2), CAD Framework Initiative, February, 1991.
P. K. Mozumder and L. M. Loewenstein. Method for Semiconductor Process Optimization Using Functional Representations and Selectivity. IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 15 (3): 311–316, June, 1992.
S. R. Nassif, A. J. Strojwas and S. W. Director. FABRICS II: A Statistically Based IC Fabrication Process Simulator. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. CAD-3(1):40–46, January, 1984.
S. R. Nassif, A. J. Strojwas, and S. W. Director. FABRICS II: A Statistical Simulator of the IC Fabrication Process. IEEE International Conference on Circuits and Computers Proceedings, pages 298–301. September, 1982.
M. S. Obrecht. SIMOS - A Two Dimensional Steady State Simulator forMOS Devices. Solid State Electronics. 34 (7), 1991.
M. S. Obrecht and J. M. G. Teven. BISIM - A Program for Steady-State Two Dimensional Modeling of Various Bipolar Devices. Solid State Electronics. 34 (7), 1991.
J. K. Ousterhout. Tcl: An Embedded Command Language. Winter USENIX Conference Proceedings. 1990.
J. K. Ousterhout. An X11 Toolkit Based on the Tcl Language. Winter USENIX Conference Proceedings. 1991.
E. W. Scheckler, A. S. Wong, R. H. Wang, G. Chin, J. R. Camagna, K. K. H. Toh, K. H. Tadros, R. A. Ferguson, A. R. Neureuther, and R. W. Dutton. A Utility-Based Integrated Process Simulation System. Symposium on VLSI Technology, Digest of Technical Papers, pages 97–98. June, 1990.
M. R. Simpson. PRIDE: An Integrated Design Environment for Semiconductor Device Simulation. Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits (NUPAD) III, pages 57–58. June, 1990.
A. J. Strojwas and S. W. Director. The Process Engineer’s Workbench. IEEE Journal of Solid-State Circuits. SC-23(2):377–386, April, 1988.
A. J. Strojwas and S. W. Director. A Process Engineer’s Workbench. Proceedings of the IEEE Custom Integrated Circuits Conference, pages 329–332. IEEE, May, 1987.
W. Fichtner. From Layout to Circuit: Multi-Dimensional Process and Device Simulation - Current Status and Open Problems. 1993 International Workshop on VLSI Process and Device Modeling. May, 1993.
D. M. H. Walker, C. S. Kellen, D. M. Svoboda, and A. J. Strojwas. The CDB/HCDB Semiconductor Wafer Representation Server. IEEE Transactions on Computer-Aided Design of Circcuits and Systems. 12 (2): 283–295, February, 1993.
J. S. Wenstramd, II. Iwai, and R. W. Dutton. A Manufacturing-oriented Environment for Synthesis of Fabrication Processes. IEEE international Conference on Computer-Aided Design (ICCAD) Digest of Technical Papers, pages 376–379. November, 1989.
J. S. Wenstrand, H. Iwai, M. Norishima, H. Tanimoto, T. Wada, and R. W. Dutton. Intelligent Simulation for Optimization of Fabrication Processes. Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits (NUPAD) III, pages 15–16. June, 1990.
A. S. Wong, D. S. Boning, M. L. Ileytens, and A. R. Neureuther. The Intertool Profile Interchange Format. Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits (NUPAD) III, pages 61–62. June, 1990.
A. S. Wong and A. R. Neureuther. The Intertool Profile Interchange Format: A Technology CAD Environment Approach. Technical Report. C90361, Semiconductor Research Corporation, July, 1990.
A. S. Wong and A. R. Neureuther. The Intertool Profile Interchange Format: A Technology CAD Environment Approach. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 10 (9): 1157–1162, September, 1991.
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Walker, D.M.H., Kibarian, J.K., Kellen, C.S., Strojwas, A.J. (1993). A TCAD Framework for Development and Manufacturing. In: Fasching, F., Halama, S., Selberherr, S. (eds) Technology CAD Systems. Springer, Vienna. https://doi.org/10.1007/978-3-7091-9315-0_5
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DOI: https://doi.org/10.1007/978-3-7091-9315-0_5
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