Abstract
A new deposition simulator is presented that allows modeling of sputter deposition processes. Various materials as well as several types of ring shaped magnetron sources can be considered. Some applications are presented to demonstrate the possibilities of the new program. It is part of the two-dimensional process simulator DUPSIM, which is able to simulate many fabrication processes of semiconductor devices in integrated circuits. Thereby a great flexibility and ease of use is reached.
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© 1993 Springer-Verlag Wien
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Seifert, M., Richter, F., Spallek, R.G. (1993). Simulation of Sputter Deposition Process by DUPSIM. In: Selberherr, S., Stippel, H., Strasser, E. (eds) Simulation of Semiconductor Devices and Processes. Springer, Vienna. https://doi.org/10.1007/978-3-7091-6657-4_48
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DOI: https://doi.org/10.1007/978-3-7091-6657-4_48
Publisher Name: Springer, Vienna
Print ISBN: 978-3-7091-7372-5
Online ISBN: 978-3-7091-6657-4
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