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Simulation of Semiconductor Devices and Processes pp 157–160Cite as

Dual Energy Transport Model with Coupled Lattice and Carrier Temperatures

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Abstract

A Dual Energy Transport (Dual ET) model was developed, that includes Poisson’s equation, carrier continuity equations and the energy balance and thermal diffusion equation. Six variables (electric potential, electron and hole concentrations, electron and hole temperatures, and lattice temperature) can be obtained, describing all electro-thermal effects in the electrons, holes and lattice subsytems. Results for diode breakdown are shown.

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References

  1. D. Chen, E. C. Kan, U. Ravaioli, C.-W. Shu and R. W. Dutton, IEEE Elec. Dev. Lett, vol. 13, no. 1, pp. 26–28, Jan. 1992.

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  2. D. Chen, E. C. Kan, U. Ravaioli, Z. Yu, K.-C. Wu and R. W. Dutton, to be published.

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  3. S. Selberherr, Analysis and Simulation of Semiconductor Devices,Vienna: Springer, 1984.

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  4. K. Bløtekjwr, IEEE Trans. Elec. Dev.,vol. 17, p. 38, 1970.

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  5. G. K. Wachutka, IEEE Trans. CAD,vol. 9, no. 11, pp. 1141–1149, Nov. 1990.

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Author information

Authors and Affiliations

  1. Integrated Circuits Laboratory, Stanford University, Stanford, CA, 94305, USA

    D. Chen, Z. Yu, K.-C. -C. Wu, R. Goossens & R. W. Dutton

Authors
  1. D. Chen
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  2. Z. Yu
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  3. K.-C. -C. Wu
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  4. R. Goossens
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  5. R. W. Dutton
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Editor information

Editors and Affiliations

  1. Institut für Mikroelektronik, Technische Universität Wien, Austria

    Siegfried Selberherr , Hannes Stippel  & Ernst Strasser ,  & 

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© 1993 Springer-Verlag Wien

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Cite this paper

Chen, D., Yu, Z., Wu, KC.C., Goossens, R., Dutton, R.W. (1993). Dual Energy Transport Model with Coupled Lattice and Carrier Temperatures. In: Selberherr, S., Stippel, H., Strasser, E. (eds) Simulation of Semiconductor Devices and Processes. Springer, Vienna. https://doi.org/10.1007/978-3-7091-6657-4_38

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  • DOI: https://doi.org/10.1007/978-3-7091-6657-4_38

  • Publisher Name: Springer, Vienna

  • Print ISBN: 978-3-7091-7372-5

  • Online ISBN: 978-3-7091-6657-4

  • eBook Packages: Springer Book Archive

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