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Mechanical and Fluidic Signals

  • Chapter
Microtransducer CAD

Part of the book series: Computational Microelectronics ((COMPUTATIONAL))

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Abstract

Simulation of the static and dynamic behavior of solid structural and fluid mechanical variables, e.g., stress, strain, strain-rate, displacement, force, and velocity, is critical to the design and analysis of microsensors and microactuators in the mechanical domain. For example, in Chapt. 6, we saw how electrical transport is modified by piezoresistance. This, in addition to deflection-induced capacitance change, can be effectively utilized for conversion of signals from the mechanical to the electrical domain. Alternatively, as we will see in Chapt. 8, a micromechanical structure subject to an electrical, thermal, magnetic, or mechanical excitation signal, gives rise to micro-actuation in the mechanical domain. In this chapter, we deal with model equations and constitutive relations relevant to: simulation of mechanical (e.g., pressure) microsensors; computation of velocity profiles relevant to flow microsensors (needed in Chapt. 5) and selected microfluidic systems; computation of mechanical stresses induced by packaging or encapsulation of microtransducers or integrated circuits (needed in Chapt. 6); and simulation of mechanical microactuators, including fluidic damping effects (needed in Chapt. 8).

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Authors and Affiliations

  1. Dept. of Electrical and Computer Engineering, University of Waterloo, Waterloo, Ontario, N2L 3G1, Canada

    Prof. Dr. Arokia Nathan

  2. Physical Electronics Laboratory, ETH Hoenggerberg, CH-8093, Zürich, Switzerland

    Prof. Dr. Henry Baltes

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  1. Prof. Dr. Arokia Nathan
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  2. Prof. Dr. Henry Baltes
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© 1999 Springer-Verlag/Wien

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Nathan, A., Baltes, H. (1999). Mechanical and Fluidic Signals. In: Microtransducer CAD. Computational Microelectronics. Springer, Vienna. https://doi.org/10.1007/978-3-7091-6428-0_7

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  • DOI: https://doi.org/10.1007/978-3-7091-6428-0_7

  • Publisher Name: Springer, Vienna

  • Print ISBN: 978-3-7091-7321-3

  • Online ISBN: 978-3-7091-6428-0

  • eBook Packages: Springer Book Archive

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