Abstract
Modeling and simulation collectively describe the complex process of constructing models of a device, process, or system, and subsequently imitating its function on a computer [1].
This is a preview of subscription content, log in via an institution.
Buying options
Tax calculation will be finalised at checkout
Purchases are for personal use only
Learn about institutional subscriptionsPreview
Unable to display preview. Download preview PDF.
References
Ziegler, B., Theory of Modeling and Simulation, Robert Krieger, 1984.
Middelhoek, S., Audet, S. A., Silicon Sensors, New York: Academic Press, 1989.
Grandke, T., Ko, W. H. (Eds.), Sensors, Vol. 1, Chapt. 1, Weinheim: VCH, 1989, pp. 1–16.
Muller, R. S., Howe, R. T., Senturia, S. D., Smith, R. L., White, R. M. (Eds.), Microsensors, New York: IEEE Press, 1991.
Sze, S. M. (Ed.), Semiconductor Sensors, New York: Wiley, 1994.
Baltes, H., Future of IC Microtransducers, Sensors and Actuators A, 56 (1996), 179–192.
Baltes, H., Paul, O., Korvink, J. G., Schneider, M., Bühler, J., Schneeberger, N., Jaeggi, D., Malcovati, P., Hornung, M., Häberli, A., von Arx, M., Mayer, F., Funk, J., IC MEMS Microtransducers, Technical Digest, IEEE IEDM, San Francisco, 1996, pp. 521–524.
Proceedings, IEEE Micro Electro Mechanical Systems Conference, Nagoya, 1997.
Engl, W. L., Dirks, H. K., Meinerzhagen, B., Device Modeling, Proc. IEEE, 71 (1983), 10–33.
Selberherr, S., Analysis and Simulation of Semiconductor Devices, Vienna: Springer-Verlag, 1984.
Baccarani, G., Rudan, M., Guerrieri, R., Ciampolini, P., Physical Models for Numerical Device Simulation, in: Process and Device Modeling, Engl, W. L. (Ed.), Amsterdam: North-Holland, 1986, pp. 107–158.
Baltes, H., Allegretto, W., Nathan, A., Microsensor Modeling, in: Simulation of Semiconductor Devices and Processes, Vol. 3, Baccarani, G., Rudan, M. (Eds.), Tecnoprint, Bologna, 1988, pp. 563–577.
Nathan, A., Baltes, H. P., Sensor Modeling, in: Sensors, Vol. 1, Grandke, T., Ko, W. H. (Eds.), Chapt. 3, Weinheim: VCH, 1989, pp. 45–77.
Nathan, A., Baltes, H., Allegretto, W., Review of Physical Models for Numerical Simulation of Semiconductor Microsensors, IEEE Trans. on CAD of ICAS, 9 (1990), 1198–1208.
Senturia, S. D., Harris, R. M., Johnson, B. P., Kim, S., Nabors, K., Shulman, M. A., White, J. K., A Computer-Aided Design System for Microelectromechanical Systems (MEMCAD), IEEE J. of Microelectromechanical Systems, 1 (1992), 3–14.
Nathan, A. (Ed.), Special Issue on Microsensor Modeling, Sensors and Materials, Vol. 6, Nos. 2-4, 1994.
Senturia, S. D., CAD for Microelectromechanical Systems, Digest of Technical Papers, Vol. 2, Transducers’ 95, Stockholm, 1995, pp. 5-8.
Baltes, H., Korvink, J. G., Paul, O., Numerical Modelling and Materials Characterization for Integrated Micro Electro Mechanical Systems, in: Simulation of Semiconductor Devices and Processes, Vol. 6, Ryssel, H., Pichler, P. (Eds.), Vienna: Springer-Verlag, 1995, pp. 1–9.
Nathan, A., Microtransducer CAD, Proc. ESSDERC’ 96, Baccarani, G., Rudan, M. (Eds.), Bologna, 1996, pp. 707-715.
Korvink, J. G., Bächtold, M., Emmenegger, M., Paganini, R., Ruehl, R., Funk, J., Baltes, H., TCAD for MEMS, Proc. ESSDERC’ 96, Baccarani, G., Rudan, M. (Eds.), Bologna, 1996, pp. A5-A7.
Korvink, J. G., Baltes, H., Microsystem Modeling, in: Sensors Update, Baltes, H., Göpel, W., Hesse, J. (Eds.), Chapt. 6, Weinheim: VCH, 1996, pp. 181–209.
Senturia, S.D., Microsensors vs. Integrated Circuits: A Study in Contrasts, Technical Digest, IEEE IEDM, Washington, 1989, pp. 3–7.
Nagata, M., Swart, N., Stevens, M., Nathan, A., Thermal Based Micro Flow Sensor Optimization Using Coupled Electrothermal Numerical Simulations, Digest of Technical Papers, Vol. 2, Transducers’ 95, Stockholm, 1995, pp. 447–450.
Swart, N. R., Heat Transport in Thermal Based Microsensors, Ph.D. Dissertation, University of Waterloo, Waterloo, Ontario N2L 3G1, Canada, 1994.
Stevens, M. E., CMOS Electrothermal Microsensors for Flow and Pressure Measurements, M. A. Sc. Dissertation, University of Waterloo, Waterloo, Ontario N2L 3G1, Canada, 1996.
Gnudi, A., Ciampolini, P., Guerrieri, R., Rudan, M., Baccarani, G., Sensitivity Analysis for Device Design, IEEE Trans. on CAD of ICAS, CAD-6 (1987), 879–885.
Briglio, D. R., Nathan, A., Baltes, H. P., Measurement of Hall Mobility in n-Channel Silicon Inversion Layer, Can. J. Phys., 65 (1987), 842–845.
Maseeh, F., Schmidt, M. A., Allen, M. G., Senturia, S. D., Calibrated Measurements of Elastic Limit, Modulus, and the Residual Stress of Thin Films Using Micromachined Suspended Structures, Technical Digest, IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Is., 1988, pp. 84–87.
Paul, O. M., Korvink, J., Baltes, H., Determination of Thermophysical Properties of CMOS Polysilicon, Sensors and Actuators A, 41-42 (1994), 161–164.
Pham, H. H., Nathan, A., Compact MEMS-SPICE Modeling, Sensors and Materials, 10 (1998), 63–75.
Swart, N., Nathan, A., Mixed-Mode Device-Circuit Simulation of Thermal-Based Microsensors, Sensors and Materials, 6 (1994), 179–192.
CAD for MEMS Workshop, Zürich, Switzerland, March 16–18, 1997.
Browne, B. T, Miller, J. J. H. (Eds.), Numerical Analysis of Semiconductor Devices, Proc. NASECODE I Conference, Dublin: Boole Press, 1979.
Lundstrom, M. S., Schwartz, R. J., Gray, J. L., Transport Equations for the Analysis of Heavily Doped Semiconductor Devices, Solid-State Electron., 24 (1981), 195–202.
Gray, J. L., Two-Dimensional Modeling of Silicon Solar Cells, Ph.D. Dissertation, Purdue University, West Lafayette, USA, 1982.
Ciampolini, P., Pierantoni, A., Baccarani, G., Efficient 3-D Simulation of Complex Structures, IEEE Trans. on CAD of ICAS, CAD-10 (1991), 1141–1149.
Ciampolini, P., Pierantoni, A., Vecchi, M. C., Rudan, M., Application of General-Purpose Device Simulator to Analysis of Integrated Silicon Microsensors, Sensors and Materials, 6 (1994), 139–157.
Mohajerzadeh, S., Nathan, A., Selvakumar, C. R., Numerical simulation of a p-n-p-n Color Sensor for Simultaneous Color Detection, Sensors and Actuators A, 44 (1994), 119–124.
Mimizuka, T., Improvement of Relaxation Method for Hall Plates, Solid-State Electron., 14 (1971), 107–110.
Chwang, R., Smith, B. J., Crowell, C. R., Contact Size Effects on the Van der Pauw Method for Resistivity and Hall Coefficient Measurement, Solid-State Electron., 17 (1974), 1217–1227.
Andor, L., Baltes, H. P., Nathan, A., Schmidt-Weinmar, H. G., Carrier Transport in Semiconductor Magnetic Field Sensors, Technical Digest, IEEE IEDM, Washington, 1983, pp. 635–638.
Baltes, H. P., Andor, L., Nathan, A., Schmidt-Weinmar, H. G., Two-Dimensional Numerical Analysis of a Silicon Magnetic Field Sensor, IEEE Trans. Electron Devices, ED-31 (1984), 996–999.
Schmidt-Weinmar, H. G., Andor, L., Baltes, H. P., Nathan, A., Numerical Modeling of Silicon Magnetic Field Sensors: Magnetoconcentration Effects in Split-Metal-Contact Devices, IEEE Trans. Magnetics, MAG-20 (1984), 975–978.
Andor, L., Baltes, H. P., Nathan, A., Schmidt-Weinmar, H. G., Numerical Modeling of Magnetic-Field-Sensitive Semiconductor Devices, IEEE Trans. Electron Devices, ED-32 (1985), 1224–1230.
Nathan, A., Huiser, A. M. J., Baltes, H. P., Two-Dimensional Numerical Modeling of Magnetic Field Sensors in CMOS Technology, IEEE Trans. Electron Devices, ED-32 (1985), 1212–1219.
Nathan, A., Andor, L., Baltes, H. P., Schmidt-Weinmar, H. G., Modeling of a Dual Drain NMOS Magnetic Field Sensor, IEEE J. Solid-State Circuits, SC-20 (1985), 819–821.
Allegretto, W., Mun, Y. S., Nathan, A., Baltes, H. P., Optimization of Semiconductor Magnetic Field Sensors using Finite Element Analysis, Proc. NASECODE IV Conf., Dublin: Boole Press, 1985, pp. 129–133.
Baltes, H. P., Popovic, R. S., Integrated Semiconductor Magnetic Field Sensors, Proc. IEEE, 74 (1986), 1107–1132.
Mun, Y., Numerical Modeling of CMOS Magnetic Field Sensors by Finite Element Method, M. Sc. Thesis, University of Alberta, Edmonton, Canada, 1986.
Nathan, A., Allegretto, W., Baltes, H. P., Sugiyama, Y., Modeling of Hall Devices Under Locally Inverted Magnetic Field, IEEE Electron Device Letts., EDL-8 (1987), 1–3.
Nathan, A., Allegretto, W., Baltes, H. P., Sugiyama, Y., Carrier Transport in Semiconductor Detectors of Magnetic Domains, IEEE Trans. Electron Devices, ED-34 (1987), 2077–2085.
Allegretto, W., Nathan, A., Baltes, H. P., Two-Dimensional Numerical Analysis of Silicon Bipolar Magnetotransistors, Proc. NASECODE V Conf., Boole Press: Dublin, 1987, pp. 87–92.
Nathan, A., Allegretto, W., Joerg, W., Baltes, H., Numerical Modeling of Bipolar Action in Magnetotransistors, Digest of Technical Papers, Transducers’ 87, Tokyo, 1987, pp. 519-522.
Nathan, A., Allegretto, W., Baltes, H. P., Galvanomagnetic Transport in p-n Junctions, Sensors and Materials, 1 (1988), 1–6.
Nathan, A., Maenaka, K., Allegretto, W., Baltes, H. P., Nakamura, T., The Hall Effect in Magnetotransistors, IEEE Trans. Electron Devices, ED-36 (1989), 108–117.
Allegretto, W., Nathan, A., Baltes, H., Numerical Analysis of Magnetic-Field-Sensitive Bipolar Devices, IEEE Trans. CAD of ICAS, 10 (1991), 501–511.
Riccobene, C., Wachutka, G., Baltes, H., Two-Dimensional Numerical Analysis of Novel Magnetotransistors with Partially Removed Substrate, Technical Digest, IEEE IEDM, San Francisco, 1992, pp. 513–516.
Korvink, J., An Implementation of the Adaptive Finite Element Method for Semiconductor Sensor Simulation, Ph.D. Dissertation, ETH Zürich, No. 10143, 1993.
Nathan, A., Bhatnagar, Y. K., Tang, D. D., Magnetic Field Bit Resolution of Integrated Circuit Polysilicon Hall Elements, Digest of Technical Papers, Transducers’ 93, Yokohama, 1993, pp. 896-899.
Manku, T., Nathan, A., O, N., Aflatooni, K., Allegretto, W., Modeling of Encapsulation Stress Effects on Output Response of Hall Sensors, Sensors and Materials, 6 (1994), 225–234.
Aflatooni, K., Strained Silicon Hall Effect Devices, M.A. Sc. Thesis, University of Waterloo, Waterloo, Ontario N2L 3G1, Canada, 1994.
Riccobene, C., Wachutka, G., Bürgler, J. F., Baltes, H., Operating Principle of Dual Collector Magnetotransistors Studied by Two-Dimensional Simulation, IEEE Trans. Electron Devices, 41 (1994), 32–41.
Riccobene, C., Wachutka, G., Baltes, H., Numerical Study of Structural Variants of Bipolar Magnetotransistors, Sensors and Materials, 6 (1994), 159–178.
Riccobene, C., Gärtner, K., Wachutka, G., Baltes, H., Fichtner, W., First Three-Dimensional Numerical Analysis of Magnetic Vector Probe, Technical Digest, IEEE IEDM, San Francisco, 1994, pp. 727–730.
Riccobene, C., Gartner, K., Wachutka, G., Baltes, H., Fichtner, W., Full Three-Dimensional Numerical Analysis of Multi-Collector Magnetotransistors with Directional Sensitivity, Sensors and Actuators A, 46-47 (1995), 289–293.
Riccobene, C., Multidimensional Analysis of Galvanomagnetic Effects in Magnetotransistors, Ph.D. Dissertation, ETH Zürich, Diss. ETH No. 11077, 1995.
Schneider, M., Korvink, J. G., Baltes, H., Magnetostatic Modeling of an Integrated Microconcentrator, Digest of Technical Papers, Vol. 2, Transducers’ 95, Stockholm, 1995, pp. 9–12.
Nathan, A., Manku, T., Modeling the Piezo-Hall Effects in n-Doped Silicon Devices, Appl. Phys. Letts., 62 (1993), 2947–2949.
Allegretto, W., Nathan, A., Manku, T., Numerical Simulation of Piezo-Hall Effects in n-Doped Silicon Magnetic Sensors, in: Simulation of Semiconductor Devices and Processes, Vol. 5, Selberherr, S., Stipel, H., Strasser, E. (Eds.), Vienna: Springer-Verlag, 1993, pp. 377–380.
Crary, S. B., Thermal Management of Integrated Microsensors, Sensors and Actuators, 12 (1987), 303–312.
van Duyn, D. C., Munter, P. J. A., Finite-Element Modeling of Thermoelectric Materials and Devices, Sensors and Actuators A, 32 (1992), 413–418.
van Duyn, D. C., Modeling and Simulation of Solid-State Transducers: The Thermal and Electrical Energy Domain, Sensors and Actuators A, 41-42 (1994), 268–274.
Swart, N., Nathan, A., Design Optimization of Integrated Microhotplates, Sensors and Actuators A, 43 (1994), 3–10.
Swart, N. R., Nathan, A., An Integrated CMOS Polysilicon Coil-Based Micro-Pirani Gauge with High Heat Transfer Efficiency, Technical Digest, IEEE IEDM, San Francisco, 1994, pp. 135–138.
Allegretto, W., Shen, B., Lai, Z., Robinson, A. M., Numerical Modelling of Time Response of CMOS Micromachined Thermistor Sensor, Sensors and Materials, 6 (1994), 71–83.
Dillner, U., Thermal Modeling of Multilayer Membranes for Sensor Applications, Sensors and Actuators A, 41-42 (1994), 260–267.
Swart, N. R., Nathan, A., Reliability Study of Polysilicon for Microhotplates, Technical Digest, Solid-State Sensor and Actuator Workshop, Hilton Head Is., 1994, pp. 119–122.
Allegretto, W., Shen, B., Haswell, P., Lai, Z., Robinson, A. M., Numerical Modeling of a Micromachined Thermal Conductivity Gas Pressure Sensor, IEEE Trans. CAD of ICAS, 13 (1994), 1247–1256.
Nathan, A., Swart, N. R., Quasi Three-Dimensional Simulation of Heat Transport in Thermal-Based Microsensors, in: Simulation of Semiconductor Devices and Processes, Vol. 6, Ryssel, H., Pichler, P. (Eds.), Vienna: Springer-Verlag, 1995, pp. 30–33.
Jaeggi, D., Funk, J., Häberli, A., Baltes, H., Overall System Analysis of a CMOS Thermal Converter, Technical Digest, Vol. 2, Transducers’ 95, Stockholm, 1995, pp. 112–115.
Park, S., Kim, H., Kang, Y., Study of Flow Sensor Using Finite Difference Method, Sensors and Materials, 7 (1995), 43–51.
Funk, J., Modeling and Simulation of IMEMS, Ph.D. Dissertation, ETH Zürich, Diss. ETH No. 11378, 1996.
Mayer, F., Salis, G., Funk, J., Paul, O., Baltes, H., Scaling of Thermal CMOS Gas Flow Microsensors: Experiment and Simulation, Proc. IEEE MEMS, San Diego, 1996, pp. 116-121.
Rudin, S., Wachutka, G., Baltes, H., Thermal Effects in Magnetic Microsensor Modeling, Sensors and Actuators A, 25-27 (1991), 731–735.
Nathan, A., Manku, T., The Thermomagnetic Carrier Transport Equation, Sensors and Actuators A, 36 (1993), 193–197.
Manku, T., Nathan, A., Electron Drift Mobility for Devices Based on Unstrained and Coherently Strained Si1-xGex grown on <001> Silicon Substrate, IEEE Trans. Electron Devices, 39 (1992), 2082–2089.
Manku, T., Nathan, A., Valence Energy-Band Structure for Strained Group-IV Semiconductors, J. Appl. Phys., 73 (1993), 1205–1213.
Manku, T., Nathan, A., Electrical Properties of Silicon Under Nonuniform Stress, J. Appl. Phys., 74 (1993), 1832–1837.
Nathan, A., Manku, T., Piezoresistance and the Drift-Diffusion Model in Strained Silicon, Simulation of Semiconductor Devices and Processes, Vol. 6, Ryssel, H., Pichler, P. (Eds.), Vienna: Springer-Verlag, 1995, pp. 94–97.
Aflatooni, K., Nathan, A., Heat Transport Properties of Semiconductors Under NonUniform Stress, Appl. Phys. Lett., 66 (1995), 1110–1111.
Aflatooni, K., Hornsey, R., Nathan, A., Thermodynamic Treatment of Mechanical Stress Gradients in Coupled Electro-Thermo-Mechanical Systems, Sensors and Materials, 9 (1997), 449–456.
Lee, K. W., Modeling and Simulation of Solid State Pressure Sensors, Ph.D. Dissertation, University of Michigan, Ann Arbor, USA, 1982.
Suzuki, S., Yamada, K., Nishihara, M., Hachino, H., Minorikawa, S., Structural Analysis of a Semiconductor Pressure Sensor, Proc., The 1st Sensor Symp., Japan, 1981, pp. 131-133.
Lee, K. W., Wise, K. D., Accurate Simulation of High-Performance Silicon Pressure Sensors, Technical Digest, IEEE IEDM, 1981, pp. 471-474.
Lee, K. W., Wise, K. D., SENSIM: A Simulation Program for Solid-State Pressure Sensors, IEEE Trans. Electron Devices, ED-29 (1982), 34–41.
Suzuki, S., Yagi, Y., Optimum Design of Silicon Pressure Sensor by Nonlinear Finite Element Method, Proc, The 2nd Sensor Symp., Japan, 1982, pp. 163-165.
Yamada, K., Nishihara, M., Shimada, S., Tanabe, M., Shimazoe, M., Matsuoka, Y., Nonlinearity of the Piezoresistance Effect of p-Type Silicon Diffused Layers, IEEE Trans. Electron Devices, ED-29 (1982), 71–77.
Bin, T. Y., Huang, R. S., CAPSS: A Thin Diaphragm Capacitive Pressure Sensor Simulator, Sensors and Actuators, 11 (1987), 1–22.
Suzuki, K., Ishihara, T., Hirata, M., Tanigawa, H., Nonlinear Analysis of a CMOS Integrated Silicon Pressure Sensor, IEEE Trans. Electron Devices, ED-34 (1987), 1360–1367.
Barth, P. W., Pourahmadi, F., Mayer, R., Poydock, J., Peterson, K., A Monolithic Silicon Accelerometer with Integral Air Damping and Overrange Protection, Technical Digest, IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Is., 1988, pp. 35–38.
Pourahmadi, F., Barth, P., Peterson, K., Modeling of Thermal and Mechanical Stresses in Silicon Microstructures, Sensors and Actuators, A21-A23 (1990), 850–855.
Zhang, Y., Crary, S. B., Wise, K. D., Pressure Sensor Design and Simulation Using the CAEMEMS-D Module, Technical Digest, IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Is., 1990, pp. 32–35.
Chau, K., Allegretto, W., Ristic, L., Simulation of Silicon Microstructures, Sensors and Materials, 5 (1991), 253–264.
Tschan, T., de Rooij, N., Characterization and Modelling of Silicon Piezoresistive Accelerometers Fabricated by a Bipolar-Compatible Process, Sensors and Actuators A, 25-27 (1991), 605–609.
Tschan, T., de Rooij, N., Bezinge, A., Analytical and FEM Modeling of Piezoresistive Silicon Accelerometers: Predictions and Limitations Compared to Experiments, Sensors and Materials, 4 (1992), 189–203.
Bergqvist, J., Finite Element Modeling and Characterization of a Silicon Condenser Microphone with a Highly Perforated Backplate, Sensors and Actuators A, 39 (1993), 191–200.
Schellin, R., Mohr, R., A Monolithically-Integrated Transistor Microphone: Modeling and Theoretical Behaviour, Sensors and Actuators A, 37-38 (1993), 666–673.
Peizhong, H., Jianzhong, G., Finite Element Simulation of Thin-Film Strain Resistance, Sensors and Actuators A, 35 (1993), 239–241.
Morikawa, T., Nonomura, Y., Tsukuda, K., Takeuchi, M., Hosono, A., 3-Dimensional Piezoresistive FEM Analysis of a New Combustion Pressure Sensor, Digest of Technical Papers, Transducers’ 93, Yokohama, 1993, pp. 598-601.
Yamada, K., Kuriyama, T., FEM Analysis for Single-Chip Multiaxial Servo Accelerometer, Sensors and Materials, 6 (1994), 211–223.
Pourahmadi, F., Review of Modeling Silicon Microsensors and Actuators, Sensors and Materials, 6 (1994), 193–209.
Lades, M., Frank, J., Funk, J., Wachutka, G., Analysis of Piezoresistive Effects in Silicon Structures Using Multidimensional Process and Device Simulation, in: Simulation of Semiconductor Devices and Processes, Vol. 6, Ryssel, H., Pichler, P. (Eds.), Vienna: Springer-Verlag, 1995, pp. 22–25.
Ciampolini, P., Pierantoni, A., Rudan, M., A CAD Environment for the Numerical Simulation of Integrated Piezoresistive Transducers, Sensors and Actuators A, 46-47 (1995), 618–622.
Bonse, M. H. W., Mul, C., Spronck, J. W., Finite-Element Modeling as a Tool for Designing Capacitive Position Sensors, Sensors and Actuators A, 46-47 (1995), 266–269.
Kadar, Z., Bossche, A., Mollinger, J., Design of a Single-Crystal Silicon-Based Micromechanical Resonator Using Finite Element Simulations, Sensors and Actuators A, 46-47 (1995), 623–627.
Benaissa, K., Integrated Silicon Opto-Mechanical Sensors, Ph.D. Dissertation, Electrical and Computer Engineering, University of Waterloo, Waterloo, Ontario N2L 3G1, Canada, 1996.
Benaissa, K., Nathan, A., IC Compatible Optomechanical Pressure Sensors Using Mach-Zender Interferometry, IEEE Trans. Electron Devices, 43 (1996), 1571–1582.
Funk, J. M., Korvink, J. G., Bühler, J., Bächtold, M., Baltes, H., SOLIDIS: A Tool for Microactuator Simulation in 3-D, IEEE J. of Microelectromechanical Systems, 6 (1997), 70–82.
Thangaraj, D., Nathan, A., Two Dimensional Analysis of Incompressible Viscous Flow in Ducts Using a Rotated Difference Scheme, Sensors and Materials, 8 (1996), 13–22.
Athavale, M. M., Yang, H. Q., Przekwas, A. J., Coupled Fluid-Thermo-Structures Simulation Methodology for MEMS Applications, Digest of Technical Papers, Transducers’ 97, Chicago, 1997, pp. 1043-1046.
Olsson, A., Stemme, G., Stemme, E., Simulation Studies of Diffuser and Nozzle Elements for Valve-Less Micropumps, Digest of Technical Papers, Transducers’ 97, Chicago, 1997, pp. 1039-1042.
Hsing, I.-M., Srinivasan, R., Harold, M. P., Jensen, K. F., Schmidt, M. A., Finite Element Simulation Strategies for Microfluidic Devices with Chemical Reactions, Digest of Technical Papers, Transducers’ 97, Chicago, 1997, pp. 1015-1018.
Qiu, X. C., Hu, L., Masliyah, J. C., Harrison, D. J., Understanding Fluid Mechanics within Electrokinetically Pumped Microfluidic Chips, Digest of Technical Papers, Transducers’ 97, Chicago, 1997, pp. 923-926.
Cho, Y.-H., Pisano, A. P., Howe, R. T., Viscous Damping Model for Laterally Oscillating Microstructures, IEEE J. of Microelectromechanical Systems, 3 (1994), 81–87.
Zhang, X., Tang, W. C., Viscous Air Damping in Laterally Driven Microresonators, Sensors and Materials, 27 (1995), 415–430.
Reuther, H. M., Weinmann, M., Fischer, M., von Münch, W., Aßmus, F., Modeling Electrostatically Deflectable Microstructures and Air Damping Effects, Sensors and Materials, 8 (1996), 251–269.
Yang, Y.-J., Senturia, S. D., Numerical Simulation of Compressible Squeezed-Film Damping, Technical Digest, IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Is., 1996, pp. 76–79.
Price, R. H., Wood, J. E., Jacobsen, S. C., The Modeling of Electrostatic Forces in Small Electrostatic Actuators, Technical Digest, IEEE Solid-State Sensors and Actuators Workshop, Hilton-Head Is., 1988, pp. 131–135.
Price, R. H., Wood, J. E., Jacobsen, S. C., Modeling Considerations for Electrostatic Forces in Electrostatic Microactuators, Sensors and Actuators, 20 (1989), 107–114.
Johnson, B. P., Kim, S., Senturia, S. D., White, J., MEMCAD Capacitance Calculations for Mechanically Deformed Square Diaphragm and Beam Microstructures, Digest of Technical Papers, Transducers’ 91, San Francisco, 1991, pp. 494-497.
Nabors, K., White, J., FastCap: A Multipole-Accelerated 3-D Capacitance Extraction Program, IEEE Trans. CAD of ICAS, 10 (1991), 1447–1459.
Gilbert, J. R., Osterberg, P. M., Harris, R. M., Ouma, D. O., Cai, X., Pfajfer, A., White, J., Senturia, S. D., Implementation of a MEMCAD System for Electrostatic and Mechanical Analysis of Complex Structures from Mask Descriptions, Proc. IEEE MEMS, Fort Lauderdale, 1993, pp. 207-212.
Sandmaier, H., Offereins, H. L., Folkmer, B., CAD Tools for Micromechanics, J. Micromech. Microeng., 3 (1993), 103–106.
Cai, X., Osterberg, P., Yie, H., Gilbert, J., Senturia, S., White, J., Self-Consistent Electromechanical Analysis of Complex 3-D Microelectromechanical Structures Using Relaxation/Multipole-Accelerated Method, Sensors and Materials, 6 (1994), 85–99.
Ananthasuresh, G. K., Kota, S., Gianchandani, Y., A Methodical Approach to the Design of Compliant Micromechanisms, Technical Digest, IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Is., 1994, pp. 189–192.
Boyd, M. R., Crary, S. B., Giles, M. D., A Heuristic Approach to the Electromechanical Modeling of MEMS Beams, Technical Digest, IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Is., 1994, pp. 123–126.
Osterberg, P., Yie, H., Cai, X., White, J., Senturia, S., Self-Consistent Simulation and Modeling of Electrostatically Deformed Diaphragms, Proc. IEEE MEMS, Oiso, 1994, pp. 28-32.
Gilbert, J. R., Legtenberg, R., Senturia, S. D., 3D Coupled Electro-Mechanics for MEMS: Applications of CoSolve-EM, Proc. IEEE MEMS, Amsterdam, 1995, pp. 122-127.
Stewart, J. T., Finite Element Modeling of Microelectromechanical Structures for Sensing Applications, Proc. SPIE, 2642 (1995), pp. 194–205.
Yie, H., Bart, S. F., White, J., Senturia, S. D., A Computationally Practical Approach to Simulating Complex Surface-Micromachined Structures with Fabrication Non-Idealites, Proc. IEEE MEMS, Amsterdam, 1995, pp. 128-133.
Lefevre, Y., Lajoie-Mazenc, M., Sarraute, E., Camon, H., First Steps Towards Design, Simulation, Modeling and Fabrication of Electrostatic Micromotors, Sensors and Actuators A, 46-47 (1995), 645–648.
Lee, J. S., Yoshimura, S., Yagawa, G., Shibaike, N., A CAE System for Micromachines: Its Application to Electrostatic Micro Wobble Actuator, Sensors and Actuators A, 50 (1995), 209–221.
Bächtold, M., Korvink, J. G., Funk, J., Baltes, H., New Convergence Scheme for Self-Consistent Electromechanical Analysis of IMEMS, Technical Digest, IEEE IEDM, Washington, 1995, pp. 605–608.
Gilbert, J. R., Ananthasuresh, G. K., Senturia, S. D., 3D Modeling of Contact Problems and Hysteresis in Coupled Electro-Mechanics, Proc. IEEE MEMS, San Diego, 1996, pp. 127-132.
Funk, J., Korvink, J. G., Bachtold, M., Buhler, J., Baltes, H., Coupled 3D Thermo-Electro-Mechanical Simulations of Microactuators, Proc. IEEE MEMS, San Diego, 1996, pp. 133-138.
Wang, P. K. C., Hadaegh, F. Y., Computation of Static Shapes and Voltages for Micromachined Deformable Mirrors with Nonlinear Electrostatic Actuators, IEEE J. of Microelectromechanical Systems, 5 (1996), 205–220.
Bächtold, M., Efficient 3D Computation of Electrostatic Fields and Forces in Microsystems, Ph.D. Dissertation, ETH Zürich, Diss. ETH No. 12165, 1997.
Funk, J., Korvink, J. G., Wachutka, G., Baltes, H., Electro-Thermo-Mechanical Field Analysis Using SESES, in: Simulation of Semiconductor Devices and Processes, Vol. 5, Selberherr, S., Stipel, H., Strasser, E. (Eds.), Vienna: Springer-Verlag, 1993, pp. 347–350.
Korvink, J. G., Funk, J., Roos, M., Wachutka, G., Baltes, H., SESES: A Comprehensive MEMS Modelling System, Proc. IEEE MEMS, Oiso, 1994, pp. 22-27.
Korvink, J. G., Funk, J., Baltes, H., IMEMS Modeling, Sensors and Materials, 6 (1994), 235–243.
Ikuta, K., Shimizu, H., Two Dimensional Mathematical Model of Shape Memory Alloy and Intelligent SMA-CAD, Proc. IEEE MEMS, Fort Lauderdale, 1993, pp. 87-91.
Krulevitch, P., Lee, A. P., Ramsey, P. B., Trevino, J. C., Hamilton, J., Northrup, M. A., Thin Film Shape Memory Alloy Microactuators, IEEE J. of Microelectromechanical Systems, 5 (1996), 270–282.
Quandt, E., Seeman, K., Fabrication and Simulation of Magnetostrictive Thin Film Actuators, Sensors and Actuators A, 50 (1995), 105–109.
Schwarzenbach, H. U., Lechner, H., Steinle, B., Baltes, H. P., Schwendimann, P., Calculation of Vibrations of Thick Piezoceramic Disk Resonators, Appl. Phys. Lett., 38 (1981), 854–855.
Langer, E., Selberherr, S., Markowich, P. A., Ringhofer, C. A., Numerical Analysis of Acoustic Wave Generation in Anisotropic Piezoelectric Materials, Sensors and Actuators A, 4 (1983), 71–76.
Lerch, R., Finite Element Analysis of Piezoelectric Transducers, Proc. IEEE Ultrasonics Symp., 1988, pp. 643-654.
Lerch, R., Piezoelectric and Acoustic Finite Elements as Tools for the Development of Electroacoustic Transducers, Siemens Forsch.-u. Entwickl.-Ber., Vol. 17, No. 6 (1988), pp. 283–290.
Brand, O., Micromachined Resonators for Ultrasound Based Proximity Sensing, Ph.D. Dissertation, ETH Zürich, Diss. ETH No. 10896, 1994.
Low, T. S., Guo, W., Modeling of a Three Layer Piezoelectric Bimorph beam with Hysteris, IEEE J. of Microelectromechanical Systems, 4 (1995), 230–237.
Lim, Y.-H., Varandan, V. V., Varandan, V. K., Finite Element Modeling of the Dynamic Response of a MEMS Sensor, Proc. SPIE, 2642 (1995), pp. 233–240.
Koppelman, G. M., OYSTER, a Three-Dimensional Structural Simulator for Micro-Electro-Mechanical Design, Sensors and Actuators, 20 (1989), 179–185.
Maseeh, F., Harris, R. M., Senturia, S. D., A CAD Architecture for Micro-Electro-Mechanical Systems, Proc. IEEE MEMS, Napa Valley, 1990, pp. 44-49.
Amster, R., Tavrow, L. S., Flynn, A. M., Intelligent CAD for Micromechanics, Proc. Microsystems Conf., Berlin, 1990, Berlin: Springer-Verlag, 1990, pp. 23–28.
Crary, S., Kota, S., Conceptual Design of Micro-Electro-Mechanical Systems, Proc. Microsystems Conf., Berlin, 1990, Berlin: Springer-Verlag, 1990, pp. 17–22.
Crary, S., Zhang, Y., CAEMEMS: An Integrated Computer-Aided Engineering Workbench for Micro-Electro-Mechanical Systems, Proc. IEEE MEMS, Napa Valley, 1990, pp. 113-114.
Harris, R. M., Maseeh, F., Senturia, S.D., Automatic Generation of a 3-D Solid Model of a Microfabricated Structure, Technical Digest, IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Is., 1990, pp. 36–41.
Crary, S., Juma, O., Zhang, Y., Software Tools for Designers of Sensor and Actuator CAE Systems, Digest of Technical Papers, Transducers’ 91, San Francisco. 1991, pp. 498-501.
Harris, R. M., Senturia, S. D., A Solution of the Mask Overlay Problem in Microelectromechanical CAD (MEMCAD), Proc. IEEE MEMS, Travemünde, 1992, pp. 58-62.
Gilbert, J. R., Osterberg, P. M., Harris, R. M., Ouma, D. O., Cai, X., Pfajfer, A., White, J., Senturia, S. D., Implementation of a MEMCAD System for Electrostatic and Mechanical Analysis of Complex Structures from Mask Descriptions, Proc. IEEE MEMS, Fort Lauderdale, 1993, pp. 207-212.
Gogoi, B., Yuen, R., Mastrangelo, C. H., The Automatic Synthesis of Planar Fabrication Process Flows for Surface Micromachined Devices, Proc. IEEE MEMS, Oiso, 1994, pp. 153–157.
Poppe, A., Rencz, M., Szekely, V., CAD Framework Concept for the Design of Integrated Microsystems, Proc. SPIE, 2642 (1995), pp. 215–224.
Lo, N. R., Pister, K. S. J., 3DμV — a MEMS 3-D Visualization Package, Proc. SPIE, 2642 (1995), pp. 290–295.
Osterberg, P. M., Senturia, S. D., MEMBUILDER: An Automatic 3D Solid Model Construction Program for Microelectromechanical Structures, Digest of Technical Papers, Vol. 2, Transducers’ 95, Stockholm, 1995, pp. 21–24.
Hasanuzzaman, M., Mastrangelo, C. H., MISTIC 1.1: A Process Compiler for Micromachined Devices, Digest of Technical Papers, Vol. 1, Transducers’ 95, Stockholm, 1995, pp. 182–185.
He, Y., Harris, R., Napadenski, G., Maseeh, F., A Virtual Prototype Manufacturing Software System for MEMS, Proc. IEEE MEMS, San Diego, 1996, pp. 122-126.
Nagler, O., Trost, M., Hillerich, B., Kozlowski, F., Efficient Design and Optimization of MEMS by Integrating Commercial Simulation Tools, Digest of Technical Papers, Transducers’ 97, Chicago, 1997, pp. 1055-1058.
Buser, R. A., de Rooij, N. F., CAD for Silicon Anisotropic Etching, Proc. IEEE MEMS, Napa Valley, 1990, pp. 111-112.
Sequin, C. H., Computer Simulation of Anisotropic Etching, Digest of Technical Papers, Transducers’ 91, San Francisco, 1991, pp. 801-806.
DeLapierre, G., Anisotropie Crystal Etching: A Simulation Program, Sensors and Actuators, 31 (1992), 264–274.
Hubbard, T. J., Antonsson, E. K., Emergent Faces in Crystal Etching, IEEE J. of Microelectromechanical Systems, 3 (1994), 19–28.
Tabata, O., Effects of Etching Products and Diffusion on Silicon Anisotropic Etching, Sensors and Materials, Special Issue on CAD for MEMS, 10 (1998) (to appear).
van Suchtelen, J., van Veenendaal, E., Nijdam, A. J., Elwenspoek, M., van Enckevort, W. J. P., Computer Simulation of Orientation-Dependent Etching of Silicon, presented at the CAD for MEMS Workshop, Zürich, 1997.
Koide, A., Tanaka, S., Simulation of Three-Dimensional Etch Profile of Silicon During Orientation-Dependent Anisotropie Etching, Proc. IEEE MEMS, Nagoya, 1997, pp. 418-423.
Senturia, S. D., Smith, R. L., Microsensor Packaging and System Partitioning, Sensors and Actuators, 15 (1988), 221–234.
Fotheringham, G., Simulation Methods for Multi-Chip Modules, Sensors and Actuators A, 30 (1992), 157–165.
Pourahmadi, F., Peterson, K., Package Design of Silicon Micromachined Sensors Using Finite Element Modeling, Digest of Technical Papers, Transducers’ 93, Yokohama, 1993, pp. 774-778.
Lin, Y., Hesketh, P. J., Schuster, J. P., Finite-Element Analysis of Thermal Stresses in a Silicon Pressure Sensor for Various Die-Mount Materials, Sensors and Actuators A, 44(1994), 145–149.
Chin, S.-W., Rajan, S. D., Nagaraj, B. K., Mahalingam, M., Automated Design Tool for Examining Microelectronic Packaging Design Alternatives, IEEE Trans. on Component, Packaging, and Manufacturing Technology, 17 (1994), 76–82.
Michel, B., Schubert, A., Dudek, R., Grosser, V., Experimental and Numerical Investigations of Thermo-Mechanically Stresses Micro-Components, Microsystem Technology, 1 (1994), 14–22.
Koen, E., Pourahmadi, F., Terry, S., A Multilayer Ceramic Package for Silicon Micromachined Accelerometers, Digest of Technical Papers, Vol. 1, Transducers’ 95, Stockholm, 1995, pp. 273–276.
Popovic, R. S., Numerical Analysis of MOS Magnetic Field Sensors, Solid-State Electronics, 28 (1985), 711–716.
Caverly, R., Peck, E., A Finite-Element Model and Characterization of the p-i-n Magnetodiode at Microwave Frequencies, Solid-State Electronics, 30 (1987), 473–477.
Swart, N. R., Nathan, A., Flow-Rate Microsensor Modelling and Optimization Using SPICE, Sensors and Actuators A, 34 (1992), 109–122.
Swart, N., Nathan, A., Mixed-Mode Device-Circuit Simulation of Thermal-Based Microsensors, Sensors and Materials, 6 (1994), 179–192.
Swart, N., Nathan, A., Coupled Electrothermal Modeling of Microheaters Using SPICE, IEEE Trans. Electron Devices, 41 (1994) 920–925.
Mouthaan, T. J., Krabbenborg, B. H., Thermodynamic Analysis of Semiconductor Structures Using a Device Simulator and Lumped Circuit Modelling, Sensors and Materials, 6 (1994), 125–137.
Auerbach, F. J., Meiendres, G., Müller, R., Scheller, G. J. E., Simulation of the Thermal Behaviour of Thermal Flow Sensors by Equivalent Electrical Circuits, Sensors and Actuators A, 41-42 (1994), 275–278.
Massobrio, G., Martinoia, S., Grattarola, M., Use of SPICE for Modeling Silicon-Based Chemical Sensors, Sensors and Materials, 6 (1994), 101–123.
Rombach, P., Langheinrich, W., Modelling of a Micromachined Torque Sensor, Sensors and Actuators A, 46-47 (1995), 294–297.
Salim, A., Manku, T., Nathan, A., Modeling of Magnetic Field Sensitivity of Bipolar Magnetotransistors Using HSPICE, IEEE Trans. on CAD of ICAS, 14 (1995), 464–469.
Veijola, T., Kuisma, H., Lahdenperä, J., Ryhänen, T., Equivalent-circuit Model of the Squeezed Gas Film in a Silicon Accelerometer, Sensors and Actuators A, 48 (1995), 239–248.
Burstein, A., Kaiser, W. J., The Microelectromechanical Gyroscope — Analysis and Simulation Using SPICE Electronic Simulator, Proc. SPIE, 2642 (1995), pp. 225–232.
Nathan, A., Self-Consistent Network Synthesis for Mixed-Signal Simulations, Int. Rep., No. 95/06, Physical Electronics Laboratory, ETH Zürich, Switzerland, 1995.
Shie, J.-S., Chen, Y.-M., Ou-Yang, M., Chou, B. C. S., Characterization and Modeling of Metal-Film Microbolometer, IEEE J. of Microelectromechanical Systems, 5 (1996), 298–306.
Mohajerzadeh, S., Nathan, A., Modeling Noise Correlation Behaviour in Dual-Collector Magnetotransistors Using Small Signal Equivalent Circuit Analysis, IEEE Trans. Electron Devices, 43 (1996), 883–888.
Tilmans, H. A. C., Equivalent Circuit Representation of Electromechanical Transducers: I. Lumped-Parameter Systems, J. Micromech. Microeng., 6 (1996), 157–176.
Ando, S., Tanaka, K., Abe, M., Fishbone Architecture: An Equivalent Mechanical Model of Cochlea and its Application to Sensors and Actuators, Digest of Technical Papers, Transducers’ 97, Chicago, 1997, pp. 1027-1030.
Voigt, P., Wachutka, G., Electro-Fluidic Microsystem Modeling Based on Kirchhoffian Network Theory, Digest of Technical Papers, Transducers’ 97, Chicago, 1997, pp. 1019-1022.
Romanowicz, B., Lerch, Ph., Renaud, Ph., Fullin, E., de Coulon, Y., Simulation of Integrated Electromagnetic Device Systems, Digest of Technical Papers, Transducers’ 97, Chicago, 1997, pp. 1051-1054.
Pham, H. H., Nathan, A., Circuit Modeling and SPICE Simulation of Mixed-Signal Microsystems, Sensors and Materials, Special Issue on CAD for MEMS, 10, No. 7 (1998) (to appear).
User’s Guide, Iowa State University Research Foundation (ISURF), Ames, IA 50011, Copyright 1985.
PISCES, Integrated Circuits Laboratory (ICL), Department of Electrical Engineering, Stanford University, CA, USA. http://www-tcad.stanford.edu/tcad/org.html.
Korvink, J. G., SOLIDIS Reference Manual 1.0, Internal Report No. 95/01, Physical Electronics Laboratory, ETH Zürich, 1995. ISE Integrated Systems Engineering AG, Technopark Zürich, Technoparkstrasse 1, CH-8005 Zürich, Switzerland.
Kriegl, W., Steiner, P, Folkmer, B., Lang, W., MICROTHERM: A Program for Thermal Modelling of Microstructures, Sensors and Actuators A, 46-47 (1995), 637–639.
ANSYS Inc., 275 Technology Drive, Canonsburg, PA 15317, USA.
MSC/NASTRAN, McNeal-Schwendler Corp., Los Angeles, CA, USA.
ADINA, Adina R&D, Inc., 71 Elton Ave., Watertown, MA 02172, USA.
Puers, B., Peeters, E., Sansen, W., CAD Tools in Mechanical Sensor Design, Sensors and Actuators, 17 (1989), 423–429.
Schwarzenbach, H. U., Korvink, J. G., Roos, M., Sartoris, G., Anderheggen, E., A Micro Electro Mechanical CAD Extension for SESES, J. Micromech. Microeng., 3 (1993), 118–122.
Anderheggen, E., Korvink, J. G., Roos, M., Sartoris, G. E., Schwarzenbach, H. U., SESES User Manual, NM Numerical Modelling GmbH, Thalwil, Switzerland, 1993.
ABAQUS, Hibbit, Karlsson, and Sorenson, Inc., 1080 Main Street, Pawtucket, RI 02860, USA.
COSMOS/M, Structural Research Analysis Corp., Santa Monica, CA, USA.
I-DEAS, Structural Dynamics Research Corp, Milford, OH., USA.
FLOWERS, Inst. für Informatik, ETH, CH-8093 Zürich, Switzerland.
TPS10 Benutzerhandbuch, T-Programm GmbH, Reutlingen, 11th Ed., 1989.
MARC, MARC Analysis Research Corp., (see [142]).
FIDAP, Fluid Dynamics International, Evanston, Illinois, USA.
FLUENT, FLUENT Inc., Centerra Resource Park, 10 Cavendish Court, Lebanon, N.H. 03766-1442, USA.
FLOTRAN, see, Ulrich, J., Zengerle, R., Static and Dynamic Flow Simulation of a KOH-Etched Microvalve Using the Finite Element Method, Sensors and Actuators A, 53 (1996), 379–385.
FLOTHERM, see, Fotheringham, G., Simulation Methods for Multi-Chip Modules, Sensors and Actuators A, 30 (1992), 157–165.
PUSI, see, Zengerle, R., Richter, M., Brosinger, F., Richter, A., Sandmaier, H., Performance Simulation of Microminiaturized Membrane Pumps, Digest of Technical Papers, Transducers’ 93, Yokohama, 1993, pp. 106-109.
Maxwell Solver, Ansoft Corp., 4 Station Square, 660 Commerce Court Bldg., Pittsburgh, PA, USA.
ALECSIS, Inst. of Prec. Eng., TU Vienna, Floragasse 7, 1040 Vienna, Austria.
MICROCOSM, 201 Willesden Dr., Cary, NC 27513, USA.
IntelliSense Corp., 16 Upton Dr., Wilmington, MA 01887, USA.
Nabors, K., Kim, S., White, J., Senturia, S., FastCap User’s Guide, Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, MIT, Cambridge, MA 02139, USA.
EFCREL, EFDYN, EFCAD, see, Lefèvre, Y., Lajoie-Mazenc, M., Sarraute, E., Lamon, H., First Stop Towards Design, Simulation, Modeling and Fabrication of Electrostatic Micromotors, Sensors and Actuators A, 46-47 (1995), 645–648.
CEDRAT S.A., 10 Chemin du Pré Carré, 38240 Meylan, France.
IES, Integrated Engineering Software, 46-1313 Border Place, Winnipeg, Manitoba, R3H 0X4, Canada.
PATRAN, PDA Engineering, Costa Mesta, CA, USA.
Geomview, Software Development Group, Geometry Center, University of Minnesota, 1300 South Second Street, Suite 500, Minneapolis, MN 55454, USA. http:// www.geom.umn.edu/welcome.html.
Pro/ENGINEER, Parametric Technology, Waltham, MA, USA.
Asaumi, K., Iriye, Y., Sato, K., Anisotropic-Etching Process Simulation System MICROCAD Analyzing Complete 3D Etching Profiles of Single Crystal Silicon, Proc. IEEE MEMS, Nagoya, 1997, pp. 412-417. MICROCAD, 3-D Etching Simulator, Fuji Research Institute Corp., URL http://www.fuji-ric.co.jp/crab/
SUPREM, Integrated Circuits Laboratory (ICL), Department of Electrical Engineering, Stanford University, CA, USA. http://www-tcad.stanford.edu/tcad/org.html.
SPICE, Industrial Liaison Program, Research Software Catalog, EECS Department, University of California, Berkeley, USA. http://hera.eecs.berkeley.edu/~software/.
Pham, H. H., Nathan, A., A New Approach for Rapid Evaluation of the Potential Field in Three Dimensions, Procedings of Royal Society London A, 455 (1999), 1–39.
Pham, H. H., Numerical Capacitance Extraction for Large Area Systems, Ph.D. Dissertation, University of Waterloo, Waterloo, Ontario NZL 3G1, Canada, 1998.
Pham, H. H., Nathan, A., WATCAP: A New Simulation Engine for Interconnect Capacitance Extraction, 1st Canadian Workshop on RF 1C Research and Development, Nov. 16, Ottawa, Canada, 1998.
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 1999 Springer-Verlag/Wien
About this chapter
Cite this chapter
Nathan, A., Baltes, H. (1999). Introduction. In: Microtransducer CAD. Computational Microelectronics. Springer, Vienna. https://doi.org/10.1007/978-3-7091-6428-0_1
Download citation
DOI: https://doi.org/10.1007/978-3-7091-6428-0_1
Publisher Name: Springer, Vienna
Print ISBN: 978-3-7091-7321-3
Online ISBN: 978-3-7091-6428-0
eBook Packages: Springer Book Archive