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Chemical Mechanical Polish for Nanotechnology

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Nanofabrication

Abstract

Chemical mechanical polish (CMP) is a process technology that was adapted from wafer polishing to IC fabrication and thereby enabled the semiconductor industry to extend optical lithography and invent novel approaches such as damascene interconnects. In this chapter, we discuss the fundamentals of CMP as well as applications of the technique to nanotechnology. These applications include established IC techniques such as damascene and dual damascene fabrication, and shallow trench isolation, and emerging processes such as gate-last technology. CMP has recently found broader applications within the nanotechnology community, and has been adapted to produce extremely smooth surfaces for materials, such as sapphire and gallium nitride, that are far beyond the usual scope of IC manufacture. It is also being explored as a fabrication technique for novel interconnect and memory materials, such as phase-change memory. This chapter examines the features of CMP that make it a fundamental top-down nanofabrication technique for such a wide range of applications.

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Authors and Affiliations

  1. Department of Chemical and Materials Engineering, University of Alberta, Edmonton, Alberta, Canada

    L. Nolan & K. Cadien

Authors
  1. L. Nolan
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  2. K. Cadien
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Correspondence to L. Nolan .

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Editors and Affiliations

  1. , National Research Council of Canada, National Institute for Nanotechnology, Saskatchewan Drive 1142, Edmonton, T6G 2M9, Alberta, Canada

    Maria Stepanova

  2. , Electrical and Computer Engineering, University of Alberta, Edmonton, T6G 2V4, Alberta, Canada

    Steven Dew

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Nolan, L., Cadien, K. (2012). Chemical Mechanical Polish for Nanotechnology. In: Stepanova, M., Dew, S. (eds) Nanofabrication. Springer, Vienna. https://doi.org/10.1007/978-3-7091-0424-8_10

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