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Failure Mechanisms in MEMS/NEMS Devices

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Springer Handbook of Nanotechnology

Part of the book series: Springer Handbooks ((SHB))

Abstract

The commercialization of MEMS/NEMS devices is proceeding slower than expected, because the reliability problems of microscopic components differ from macroscopically known behavior. In this chapter, we provide an overview of the state of the art in MEMS/NEMS reliability. We discuss the specific, MEMS-related problems caused by stiction due to surface forces and electric charge. Materials issues such as creep and fatigue are treated as well. Nanoscale wear is covered briefly. MEMS packaging is also discussed, because the reliability of MEMS/NEMS components critically depends on the available protection from the environment.

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Authors and Affiliations

  1. Falco Systems, Van Boshuizenstr. 12, 1083BA, Amsterdam, Netherlands

    W. Merlijn van Spengen

  2. EPCOS AG, Anzinger Str. 13, 81671, Munich, Germany

    Robert Modliński

  3. ESAT/MICAS, KU Leuven, Kasteelpark, Arenberg 10, Box 2443, 3001, Leuven, Belgium

    Robert Puers

  4. IMEC, Kapeldreef. 75, 3001, Leuven, Belgium

    Anne Jourdain

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  1. W. Merlijn van Spengen
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  3. Robert Puers
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  4. Anne Jourdain
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Bharat Bhushan

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van Spengen, W.M., Modliński, R., Puers, R., Jourdain, A. (2017). Failure Mechanisms in MEMS/NEMS Devices. In: Bhushan, B. (eds) Springer Handbook of Nanotechnology. Springer Handbooks. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-54357-3_40

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