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Development of IR MEMS Sensor Connected to Smart Phone via Earphone Jack

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Computer Science and its Applications

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 330))

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Abstract

Recently, a variety of external accessory devices is applied to the smart phone. Among them, external devices which communicate through earphone jack are outstanding. The reason is that communication via earphone jack can be fixed on the smartphone easily. In this paper, The IR MEMS sensor, still under development, is presented. This IR MEMS sensor for smartphone can evaluate current temperature of the target and can be applied in many ways.

This research was financially supported by the Ministry of Trade, Industry & Energy(MOTIE), Korea Institute for Advancement of Technology(KIAT) and Daegyeong Institute for Regional Program Evaluation(DGIRPE) through the Leading Industry development for Economic Region.

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References

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Author information

Authors and Affiliations

  1. Department of Electronic Engineering, Kumoh National Institute of Technology, Gumi-si, Republic of Korea

    Gi-woong Shin

  2. LINC, Kumoh National Institute of Technology, Gumi, Gyeongbuk, 730-701, Republic of Korea

    Young-hyung Kim & Yong-hwan Lee

Authors
  1. Gi-woong Shin
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  2. Young-hyung Kim
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  3. Yong-hwan Lee
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Corresponding author

Correspondence to Gi-woong Shin .

Editor information

Editors and Affiliations

  1. Department of Computer Science and Engineering, Seoul University of Science and Technology (SeoulTech), Seoul, Korea, Republic of (South Korea)

    James J. (Jong Hyuk) Park

  2. School of IT and Engineering, University of Ottawa, Ottawa, Ontario, Canada

    Ivan Stojmenovic

  3. Humanitas College, Kyung Hee University, Seoul, Korea, Republic of (South Korea)

    Hwa Young Jeong

  4. Computer Science & Engineering, Gangneung-Wonju Natioanl University, Wonju, Korea, Republic of (South Korea)

    Gangman Yi

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Shin, Gw., Kim, Yh., Lee, Yh. (2015). Development of IR MEMS Sensor Connected to Smart Phone via Earphone Jack. In: Park, J., Stojmenovic, I., Jeong, H., Yi, G. (eds) Computer Science and its Applications. Lecture Notes in Electrical Engineering, vol 330. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-45402-2_69

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  • DOI: https://doi.org/10.1007/978-3-662-45402-2_69

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-662-45401-5

  • Online ISBN: 978-3-662-45402-2

  • eBook Packages: EngineeringEngineering (R0)

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