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Silicon Atomic Quantum Dots Enable Beyond-CMOS Electronics

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Field-Coupled Nanocomputing

Part of the book series: Lecture Notes in Computer Science ((LNTCS,volume 8280))

Abstract

We review our recent efforts in building atom-scale quantum-dot cellular automata circuits on a silicon surface. Our building block consists of silicon dangling bond on a H-Si(001) surface, which has been shown to act as a quantum dot. First the fabrication, experimental imaging, and charging character of the dangling bond are discussed. We then show how precise assemblies of such dots can be created to form artificial molecules. Such complex structures can be used as systems with custom optical properties, circuit elements for quantum-dot cellular automata, and quantum computing. Considerations on macro-to-atom connections are discussed.

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Author information

Authors and Affiliations

  1. Department of Physics, University of Alberta, 11322-89 Avenue, Edmonton, AB, T6G 2G7, Canada

    Robert A. Wolkow & Bruno V. C. Martins

  2. National Institute for Nanotechnology, National Research Council of Canada, 11421 Saskatchewan Drive, Edmonton, AB, T6G 2M9, Canada

    Robert A. Wolkow, Jason Pitters, Mark Salomons & Martin Cloutier

  3. Quantum Silicon Inc., 11421 Saskatchewan Drive, Edmonton, AB, T6G 2M9, Canada

    Robert A. Wolkow, Lucian Livadaru, Marco Taucer & Paul Piva

Authors
  1. Robert A. Wolkow
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  2. Lucian Livadaru
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  4. Marco Taucer
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  5. Paul Piva
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  6. Mark Salomons
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  7. Martin Cloutier
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  8. Bruno V. C. Martins
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Corresponding author

Correspondence to Robert A. Wolkow .

Editor information

Editors and Affiliations

  1. University of Massachusetts Amherst, Amherst, Massachusetts, USA

    Neal G. Anderson

  2. University of South Florida, Tampa, Florida, USA

    Sanjukta Bhanja

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Wolkow, R.A. et al. (2014). Silicon Atomic Quantum Dots Enable Beyond-CMOS Electronics. In: Anderson, N., Bhanja, S. (eds) Field-Coupled Nanocomputing. Lecture Notes in Computer Science(), vol 8280. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-43722-3_3

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  • DOI: https://doi.org/10.1007/978-3-662-43722-3_3

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  • Online ISBN: 978-3-662-43722-3

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