Abstract
Integral substrate package technology has been in existence for many years, although it is rarely used in large-scale hybrid circuit production. It offers the hybrid circuit manufacturer a method for producing high reliability, hermetically sealed circuits that possess many advantages over circuits mounted in plug-in, one piece, drawn packages.
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© 1988 Springer-Verlag Berlin Heidelberg
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Koszykowski, A.W. (1988). Integral Substrate Package Technology. In: Riley, F. (eds) The Electronics Assembly Handbook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-13161-9_38
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DOI: https://doi.org/10.1007/978-3-662-13161-9_38
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-13163-3
Online ISBN: 978-3-662-13161-9
eBook Packages: Springer Book Archive