Abstract
While recent years have not seen spectacular technological change or burgeoning growth for the hybrid industry, most signs point towards the steady influx of new applications for this mature and surprisingly popular packaging approach. Although most hybrids continue to be built with the ‘standard’ manufacturing method — noble metal thick film and wire bonding — other techniques also have their adherents. There appears to be no end in sight to the industry’s traditional diversity. Moreover, the Silicon Valley doom-sayers’ predictions of the demise of the hybrid under the onslaught of VLSI show absolutely no sign of coming true — the hybrid sector is big, stable and healthy, perhaps more so than ever before.
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© 1984 Springer-Verlag Berlin Heidelberg
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Brown, D., Freedman, M. (1984). New Applications. In: Riley, F. (eds) The Electronics Assembly Handbook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-13161-9_36
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DOI: https://doi.org/10.1007/978-3-662-13161-9_36
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-13163-3
Online ISBN: 978-3-662-13161-9
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