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Fundamentals of CMP Slurry

Chapter
Part of the Springer Series in Materials Science book series (SSMATERIALS, volume 69)

Abstract

Slurries are not new. In some form or another they have been around since individuals began polishing surfaces. The reasons vary depending upon the times, such as inlaid metal on Roman shields or Galileo’s first lenses. However they all consisted of the same components, a solution and an abrasive. It was a natural technology transfer of the lens polishing slurry to semiconductor wafer polishing slurries in the early 1980’s. The reasons were the need to planarize what was then advanced next-generation IC devices in a manner more reproducible and reliable than existing technology allowed. Although the application of the slurry was an advance in the semiconductor technology, the slurry composition remained unchanged from the composition used in lens polishing. However the devices soon became more complex and CMP related defects became more apparent as yield limits. This resulted in more attention to the finer details of CMP, in particular the slurry.

Keywords

Removal Rate Shelf Life Silicon Nitride Fumed Silica Settling Rate 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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