Skip to main content
SpringerLink
Log in

An MCM Microcontroller for Automotive Applications

  • Conference paper
Advanced Microsystems for Automotive Applications 99

Part of the book series: Springer and the environment ((VDI-BUCH))

  • 197 Accesses

Abstract

A fast microcontroller in a high density Multichip Module (MCM) package is developed which is EMC compliant and suitable for automotive and industrial applications. The 16-Bit Microcontroller MCM was realised in laminate technology with wire-bond chip interconnection and a custom-specific package in reflow-soldered edge clip gullwings in standard QFP-outline. The EMC-constraints were easily solved by shielding the MCM with its own ground-plane. Reliability and cost-targets are met by the widely-structured, low-cost 4 layer laminate technology. It can be used in a wide range of industrial and automotive applications. A number of variants of the MCM design are now under development

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution
Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 39.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 54.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. W. Strohschein, A. Simsek, H. Reichl: A 16-Bit Microcontroller MCM-L for Automotive and Industrial Applications compared with MCM-D Technology. IEEE Workshop on Microsystem Packaging Techniques and Manufacturing Technologies, 4–5 May 1998, Brugge

    Google Scholar 

  2. F. Ansorge, K. F. Becker et. al: Assembly & reliability testing under harsh environment conditions for the qualification of MCM-L technology for automotive applications. ITAP98, Feb 1998 Sunnyvale

    Google Scholar 

  3. A. Ostmann, G. Motulla et. al.: Low cost techniques for Flip Chip Soldering. Proc. SMI Conf. 96, San Jose

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Fraunhofer Institut FhG-IZM, Gustav-Meyer-Allee 25, 13355, Berlin, Germany

    Arzu Simsek, Wilhard Strohschein & Herbert Reichl

Authors
  1. Arzu Simsek
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Wilhard Strohschein
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Herbert Reichl
    View author publications

    You can also search for this author in PubMed Google Scholar

Editor information

Editors and Affiliations

  1. VDI/VDE-Technologiezentrum Informationstechnik GmbH, Rheinstr. 10B, D-14513, Teltow, Germany

    Detlef Egbert Ricken  & Wolfgang Gessner  & 

Rights and permissions

Reprints and permissions

Copyright information

© 1999 Springer-Verlag Berlin Heidelberg

About this paper

Cite this paper

Simsek, A., Strohschein, W., Reichl, H. (1999). An MCM Microcontroller for Automotive Applications. In: Ricken, D.E., Gessner, W. (eds) Advanced Microsystems for Automotive Applications 99. Springer and the environment. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-03838-3_28

Download citation

  • DOI: https://doi.org/10.1007/978-3-662-03838-3_28

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-662-03840-6

  • Online ISBN: 978-3-662-03838-3

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics

Search

Navigation