Abstract
The deposition of particles on the wafer surface from the air or gas phases follows the various mechanisms shown in Fig. 6.1. When the particle is transported by a gas flow to the vicinity of the wafer, Brownian diffusion, inertia, gravity, electrical force, and thermophoretic force cause its deposition on the wafer surface, and finally adhesion forces, such as the van der Waals force, electrostatic force, and Born repulsion, fix it to the surface. Therefore, in order to evaluate the deposition of particles on the wafer, it is essential to understand the dynamics of particles in a fluid.
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© 1998 Springer-Verlag Berlin Heidelberg
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Adachi, M., Okuyama, K. (1998). Particle Deposition in Air. In: Hattori, T. (eds) Ultraclean Surface Processing of Silicon Wafers. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-03535-1_6
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DOI: https://doi.org/10.1007/978-3-662-03535-1_6
Publisher Name: Springer, Berlin, Heidelberg
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