Skip to main content
  • 567 Accesses

Abstract

We stated in Chapter 19 that heat conduction can be described as the transfer of thermal energy from the hot to the cold part of a piece of material. We shall discuss now the mechanisms which are involved in this transfer of thermal energy.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 74.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

Copyright information

© 1985 Springer-Verlag Berlin Heidelberg

About this chapter

Cite this chapter

Hummel, R.E. (1985). Thermal Conduction. In: Electronic Properties of Materials. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-02424-9_21

Download citation

  • DOI: https://doi.org/10.1007/978-3-662-02424-9_21

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-662-02426-3

  • Online ISBN: 978-3-662-02424-9

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics