Chip Packaging

  • Andrew H. Eschenfelder
Part of the Springer Series in Solid-State Sciences book series (SSSOL, volume 14)

Abstract

A practical storage unit or other bubble device will include multiple chips packaged together and the package must supply the electrical connections to the chips and the environment required for their operation (bias field, drive field, control currents, temperature stability, etc.). In general, the bubble components are incorporated in the packaging scheme used for semiconductor and other electronic components. Since these schemes are well known and adequately covered in the literature we need not discuss them here. However, we briefly discuss some of the factors that are unique to bubble devices. First we identify the ingredients, peculiar to bubble chips, that must be supplied by the packaging and then how those ingredients are distributed in the several levels of the packaging hierarchy (module, card, board). We will pay particular attention to the factors that limit the chip area which can be included in a single module.

Keywords

Bias Field Chip Area Storage Unit Storage Module Lead Frame 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer-Verlag Berlin Heidelberg 1980

Authors and Affiliations

  • Andrew H. Eschenfelder
    • 1
  1. 1.IBM Research LaboratorySan JoseUSA

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