Abstract
Optical lithography has made possible in integrated circuit manufacturing a unique combination of high volume, high precision, and low cost. Conventional semiconductor devices can probably function with dimensions very much smaller than they have at present [1,2] and too small for optical patterning. Development of electron and X-ray lithography has been underway for 14 and 8 years, respectively, both techniques offering increased resolution. Requirements for higher patterning precision, such as better level to level registration and better linewidth control, are often more difficult goals than smaller linewidth, leading to greater refinement and complexity of exposure tools.
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Watts, R.K. (1982). Advanced Lithography. In: Barbe, D.F. (eds) Very Large Scale Integration (VLSI). Springer Series in Electrophysics, vol 5. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-88640-9_3
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