Abstract
A transmission electron microscopy study was carried out on β-SiC films grown on Silicon {111} by the CVD technique.1 Both plan view and cross-sectional samples were observed. A high density of interfacial twins and stacking faults were observed in the epilayers. Cross-sectional high resolution micrographs showed the interfaces to be semi-coherent. In addition, it was found that only films grown at 1100°C with flow rates of 10/10,20/20 and 30/30 were single crystalline.
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References
K. Shibahra, T. Saito, S. Nishino, and H. Matsunami, Extended Abstracts of the 18th International Conference on Solid State Devices and materials, Tokyo, 1986, pp. 717–718.
J. A. Powell, L. G. Matus, M. A. Kuczmarski, C. M. Chorey, T. T. Cheng, and P. Pirouz, Appl. Phys. Lett. 51, 823 (1987)
L. G. Matus and J. A. Powell, Proceedings of the 1st International Conference on Amorphous and Crystalline Silicon Carbide and Related Materials, Dec. 10–11, 1987.
H. S. Kong, Y. C. Wang, J. T. Glass, and R. F. Davis, J. Mater. Res. 1, 521 (1988).
W. E. Nelson, F. A. Halden and A. Rosengreen, J. Appl. Phys. 37, 333 (1966).
H. Matsunami, S. Nishino and H. Ono, IEEE Trans. Electron. Devices ED-28 1235 (1981).
M. Baranov. V. A. Dmitriev, I. P. Nikitina, and T. S. Kondvateva. See this proceeding.
P. Pirouz, F. Ernst and T. T. Cheng. Mat. Res. Soc. Symp. Proc. Vol 116, (1988)
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© 1992 Springer-Verlag Berlin Heidelberg
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Fekade, K., Spencer, M.G., Nahm, S., Salamanca-Riba, L.G. (1992). TEM Study of β-SiC Films Grown on (111) Silicon Substrates. In: Yang, C.Y., Rahman, M.M., Harris, G.L. (eds) Amorphous and Crystalline Silicon Carbide IV. Springer Proceedings in Physics, vol 71. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-84804-9_26
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DOI: https://doi.org/10.1007/978-3-642-84804-9_26
Publisher Name: Springer, Berlin, Heidelberg
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