Toward a Technology of Electronic Circuits with High-Tc Superconductors

  • A. I. Braginski
Part of the Springer Proceedings in Physics book series (SPPHY, volume 64)


Material requirements for a thin film high-Tc integrated electronic circuits technology are formulated. On this base, discussed are obstacles and recent progress in substrates, films and superconductor/insulator multilayers, patterning, crossovers, contacts, passive and active elements, and finally, the circuit integration.


Grain Boundary Josephson Junction Epitaxial Film Passive Device YBCO Layer 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© Springer-Verlag Berlin Heidelberg 1992

Authors and Affiliations

  • A. I. Braginski
    • 1
  1. 1.Institut für Schicht und Ionentechnik (ISI)Forschungszentrum Jülich (KFA)JülichFed. Rep. of Germany

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