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Continua with Latent Microstructure

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Analysis and Thermomechanics

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Abstract

In [1] a general dynamic model of a continuum with microstructure was proposed which is inspired by (and contains as special cases) known models for continua with voids, liquid crystals, multipolar media, etc. The elementary background which supports the proposal was described at length in a course of lectures [2] at the Banach Institute, Warsaw, and reported later in a paper [3]. Further arguments in favour of the model can be found in [4], where, in particular, the case of a fluid with microstructure is studied in some detail.

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References

  1. G. Capriz & P. Podio-Guidugli, Materials with finite-dimensional structure, in A. P. S. Selvadurai, ed., Mechanics of Structured Media. Elsevier (1981), 255–268.

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  2. G. Capriz, Introductory remarks to the dynamics of continua with microstructure, im Mathematical Methods and Models in Mechanics. Banach Center Publ. 15 (1985), 85–109.

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  3. G. Capriz & P. Podio-Guidugli, Structured continua from a Lagrangian point of view. Ann. Mat. Pura Appl. 135 (1983), 1–25.

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  4. G. Capriz, Continui con microstruttura. Boll. Un. Mat. Ital. 3A (1984), 181–195.

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  5. R. A. Toupin, Theories of elasticity with couple-stress. Arch. Rational Mech. An. 17 (1964), 85–112.

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  6. J. E. Dunn & J. Serrin, On the thermomechanics of interstitial working. IMA Preprint 24 (1983).

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  7. G. A. Maugin, The method of virtual power in continuum mechanics. Acta Mechanica 35 (1980), 1–70.

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Authors and Affiliations

  1. Università di Pisa, Italy

    Gianfranco Capriz

Authors
  1. Gianfranco Capriz
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Dedicated to Walter Noll on his sixtieth birthday

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© 1987 Springer-Verlag Berlin Heidelberg

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Capriz, G. (1987). Continua with Latent Microstructure. In: Analysis and Thermomechanics. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-61598-6_9

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  • DOI: https://doi.org/10.1007/978-3-642-61598-6_9

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-18125-5

  • Online ISBN: 978-3-642-61598-6

  • eBook Packages: Springer Book Archive

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