Summary
Two approaches were investigated to provide selective encapsulation for surface-micromachined pressure sensor devices. The techniques provide a means for allowing packaging encapsulant to be dispensed over the critical corrosion-susceptible areas of a pressure sensor device: the bondpad and wirebonds, without encroaching on the pressure sensor diaphragm (i.e., a “dam”). This is critical for applications where the pressure sensor, with the increased mass of the encapsulant, is exposed to an acceleration that causes a significant cross-sensitivity. The first method uses a glass-frit-bonded bulk micromachined silicon cap wafer, and the second method uses a patterned polymeric gel-like material in the assembly area to create this dam. Both methods have passed exposure testing to harsh chemical environments, including nitric acid and salt water, at elevated temperature.
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Li, G. et al. (2001). Selective Encapsulation Using a Polymeric or Bonded Silicon Constraint Dam for Media Compatible Pressure Sensor Applications. In: Obermeier, E. (eds) Transducers ’01 Eurosensors XV. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-59497-7_41
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DOI: https://doi.org/10.1007/978-3-642-59497-7_41
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