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Thin Film and Depth Profile Analysis pp 5–38Cite as

The Application of Beam and Diffraction Techniques to Thin Film and Surface Micro-Analysis

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Part of the book series: Topics in Current Physics ((TCPHY,volume 37))

Abstract

A large number of methods currently available for the investigation of thin films, interfaces and surfaces are reviewed. Some of these methods such as AES, ESCA, ISS, LAMMA, LOES, SIMS and ultrasound microscopy — typical “beam techniques” — are relatively young. The analytical features of classical methods such as electron microscopy or X-ray diffraction surpass these modern beam techniques either because they incorporate additional analytical facilities (energy dispersive X-ray detection, electron energy-loss spectroscopy in SEM and TEM) or because of improvements in the instrumental setup as a whole. These methods include X-ray diffraction line-width and line-shift analysis and Lang topography, and can therefore give additional information not available with beam techniques. Lack of this information may often make it impossible to solve a given analytical problem or might lead to wrong conclusions in material research and analysis.

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  1. H. W. Werner
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Editors and Affiliations

  1. Universität Kaiserslautern, Erwin-Schrödinger-Straße, Gebäude 46, D-6750, Kaiserslautern, Fed. Rep. of Germany

    Hans Oechsner

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Werner, H.W. (1984). The Application of Beam and Diffraction Techniques to Thin Film and Surface Micro-Analysis. In: Oechsner, H. (eds) Thin Film and Depth Profile Analysis. Topics in Current Physics, vol 37. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-46499-7_2

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  • DOI: https://doi.org/10.1007/978-3-642-46499-7_2

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-46501-7

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