Summary
Thin film layers deposited by plasma enhanced chemical vapor deposition (PECVD) are utilized in the construction of bubble-jet-and thermal transfer-printheads for the protection of the heater arrays. Particularly hard material like Silicon carbide improves wear resistance and lifetime of such components. Deposition parameters and properties of suitable PECVD-layers are reported and discussed.
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© 1990 Springer-Verlag Berlin Heidelberg
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Unger, E. (1990). PECVD-Passivation Layers for Printheads in Micro-System-Technology. In: Reichl, H. (eds) Micro System Technologies 90. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-45678-7_35
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DOI: https://doi.org/10.1007/978-3-642-45678-7_35
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-45680-0
Online ISBN: 978-3-642-45678-7
eBook Packages: Springer Book Archive