Abstract
Rapid miniaturization of microelectronics, microtechnology, and nanotechnology products has revealed new challenges corresponding to thermo-mechanical reliability. Besides accelerated testing of products and components and numerical finite element analysis, mainly deformation measurement methods are looked for. They allow us to understand response of components to environmental and functional thermo-mechanical loading and are part of advanced reliability studies.
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Keller, J., Vogel, D., Schubert, A., Michel, B. (2004). Displacement and Strain Field Measurements from SPM Images. In: Applied Scanning Probe Methods. NanoScience and Technology. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-35792-3_8
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DOI: https://doi.org/10.1007/978-3-642-35792-3_8
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-00527-8
Online ISBN: 978-3-642-35792-3
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