Robust 3D Radio Sensor Systems with Embedded Active and Passive Components for Industrial Applications

  • Michael Niedermayer
  • Hendrik Scholtz
  • Thomas Bonim
  • Stephan Guttowski
  • Klaus-Dieter Lang
Conference paper
Part of the Communications in Computer and Information Science book series (CCIS, volume 338)

Abstract

Future miniaturized wireless sensor nodes will increasingly support the coordination of production processes and provide substantial cost savings as part of condition-based maintenance. Production processes can be made ​​much more flexible. A modular assembly concept has been developed for industrial environments. Module integration technologies for embedding electronic components into the substrate offer particular advantages for the design of small wireless sensor systems. However, several challenges arise during the module layout. An example of industrial sensors for condition monitoring illustrates how to implement fully functional prototypes.

Keywords

wireless sensor nodes embedded devices 3D packaging condition monitoring design methods 

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Copyright information

© Springer-Verlag Berlin Heidelberg 2012

Authors and Affiliations

  • Michael Niedermayer
    • 1
  • Hendrik Scholtz
    • 2
  • Thomas Bonim
    • 1
  • Stephan Guttowski
    • 1
  • Klaus-Dieter Lang
    • 2
  1. 1.Fraunhofer Institute for Reliability and MicrointegrationBerlinGermany
  2. 2.Technical University Berlin Center of Advanced PackagingBerlinGermany

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