Abstract
Wafer lapping process affects product quality and competitiveness. Improving existing wafer lapping equipment, adding a automatically tuning system of slurry flow rate, wafer surface quality is improved, defective goods are decreased, and cost is saved.
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© 2012 Springer-Verlag Berlin Heidelberg
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Jin, L., Wang, Y., Wang, G., Yang, C. (2012). Improvement of Lapping Machine Slurry Supplying System. In: Jin, D., Lin, S. (eds) Advances in Mechanical and Electronic Engineering. Lecture Notes in Electrical Engineering, vol 176. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-31507-7_1
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DOI: https://doi.org/10.1007/978-3-642-31507-7_1
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-31506-0
Online ISBN: 978-3-642-31507-7
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