Future Prospect of Nanoelectronic Devices

  • Mojtaba Joodaki
Part of the Lecture Notes in Electrical Engineering book series (LNEE, volume 175)


A significant approach to enhance information throughput beyond the traditional scaling is to integrate the best features of the current memories into a fabrication technology compatible with CMOS technology process with better scalability than SRAM and FLASH [1]. The fabrication technology should be applicable to both stand-alone and embedded memory applications. A major detractor of MPU ability to execute programs is the time delay needed for transferring data between the processor and memory. Such a fabrication technology can increase MPU cache memory which yields a much faster data processing. Furthermore, the development of high speed and high density random access nonvolatile memory is a great success in computer architecture.


Domain Wall Phase Change Material Ferromagnetic Layer Memory Element Free Layer 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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© Springer-Verlag Berlin Heidelberg 2013

Authors and Affiliations

  1. 1.Dept. of Electrical Engineering, Faculty of EngineeringFerdowsi University of MashhadMashhadIran

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