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The Application of X-ray Photoelectron Spectroscopy Technology in Wood Adhesives

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Book cover Software Engineering and Knowledge Engineering: Theory and Practice

Part of the book series: Advances in Intelligent and Soft Computing ((AINSC,volume 162))

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Abstract

In recent years, X-ray photoelectron spectroscopy (XPS) technology emerges from wood adhesive bonding surface and interface research and analysis, and becomes an important analytical tool in wood adhesive research area. In order to deep the understanding of XPS technology and expand its application in the field of adhesive application, this paper describes the basic working principles and the basic functions of XPS and the results integrate with examples in adhesive research area and thus to illustrate the application status of XPS in the area of adhesive researches, especially in the surface and interface researches. XPS will improve the cementation strength of adhesive and the quality of cementations materials and extend its service life.

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Correspondence to Yingfeng Zuo .

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© 2012 Springer-Verlag GmbH Berlin Heidelberg

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Zuo, Y., Gu, J., Tan, H., Zhang, D., Li, P., Zhang, Y. (2012). The Application of X-ray Photoelectron Spectroscopy Technology in Wood Adhesives. In: Zhang, W. (eds) Software Engineering and Knowledge Engineering: Theory and Practice. Advances in Intelligent and Soft Computing, vol 162. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-29455-6_111

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  • DOI: https://doi.org/10.1007/978-3-642-29455-6_111

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-29454-9

  • Online ISBN: 978-3-642-29455-6

  • eBook Packages: EngineeringEngineering (R0)

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