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3D Design

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Abstract

Modern three-dimensional (3D) designs, in which the active devices are placed in multiple layers using 3D integration technologies, are helping to maintain the validity of Moore’s law in today’s nano era. In this chapter, an overview of technologies and physical design in the new 3-dimensional context is presented. A survey of modern 3D integration technologies, such as 3D packages and 3D integrated circuits, is given first. The author then investigates the physical design steps of floorplanning, placement and routing to identify the new design challenges and solutions of 3D nanoscale circuits.

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Acknowledgments

The author would like to thank Robert Fischbach and Tilo Meister for their contributions to this work.

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Authors and Affiliations

  1. Institute of Electromechanical and Electronic Design, Technische Universität Dresden, 01062, Dresden, Germany

    Jens Lienig

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  1. Jens Lienig
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Correspondence to Jens Lienig .

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Editors and Affiliations

  1. Fak. Elektrotechnik, Inst. Festkörperelektronik, TU Dresden, Helmholtzstr. 18, Dresden, 01069, Sachsen, Germany

    Gerald Gerlach

  2. Fak. Elektrotechnik und, Informationstechnik, TU Dresden, Mommsenstr. 13, Dresden, 01069, Sachsen, Germany

    Klaus-Jürgen Wolter

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Lienig, J. (2012). 3D Design. In: Gerlach, G., Wolter, KJ. (eds) Bio and Nano Packaging Techniques for Electron Devices. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-28522-6_4

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