Abstract
The integration of organic light-emitting diodes (OLED) into semiconductor technology (CMOS) requires a protection, called encapsulation, which covers the OLED forming a barrier against the environment (oxygen, moisture, mechanical). The essential encapsulation technology has to be suitable for full-wafer production regarding low chip cost, fast throughput and accurate processing. A combination of thin-film and direct encapsulation might result in a proper protection for organic devices, containing the advantages of a good barrier, mechanical protection, easy extension with light-forming components and a pre-protection. Aligned adhesive wafer bonding technology is characterized for this hybrid encapsulation approach. A flow of fabrication steps is discussed, which builds up a sandwich of a CMOS wafer with the OLED and a cover glass wafer with color filter structures. This process flow manufactured an OLED microdisplay, which is implemented in a head-mounted display demonstrator.
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High-performance OLED microdisplays, www.hypoled.org, collaborative project of European partners funded under the STREP scheme of the European Commission’s (EC) Frame Program 7 (FP7, ICT-2007.3.2-217067).
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Schmidt, C. (2012). Direct Encapsulation of OLED on CMOS. In: Gerlach, G., Wolter, KJ. (eds) Bio and Nano Packaging Techniques for Electron Devices. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-28522-6_29
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