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Direct Encapsulation of OLED on CMOS

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Abstract

The integration of organic light-emitting diodes (OLED) into semiconductor technology (CMOS) requires a protection, called encapsulation, which covers the OLED forming a barrier against the environment (oxygen, moisture, mechanical). The essential encapsulation technology has to be suitable for full-wafer production regarding low chip cost, fast throughput and accurate processing. A combination of thin-film and direct encapsulation might result in a proper protection for organic devices, containing the advantages of a good barrier, mechanical protection, easy extension with light-forming components and a pre-protection. Aligned adhesive wafer bonding technology is characterized for this hybrid encapsulation approach. A flow of fabrication steps is discussed, which builds up a sandwich of a CMOS wafer with the OLED and a cover glass wafer with color filter structures. This process flow manufactured an OLED microdisplay, which is implemented in a head-mounted display demonstrator.

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Notes

  1. 1.

    Details on photometric values, their definition and measurement can be found in [16, 35].

  2. 2.

    High-performance OLED microdisplays, www.hypoled.org, collaborative project of European partners funded under the STREP scheme of the European Commission’s (EC) Frame Program 7 (FP7, ICT-2007.3.2-217067).

References

  1. Addison Clear Wave: AC A1428–UV-curable epoxy sealant of flexible OLED sealant. Technical Report (2002). http://www.addisoncw.com

  2. Applied Microengineering Ltd.: Aligner wafer bonders. Technical Report (2008). http://www.aml.co.uk

  3. Aziz, H., Popovic, Z.D.: Degradation phenomena in small-molecule organic light-emitting devices. Chem. Mater. 16, (2004). doi:10.1021/cm040081o

  4. Buchhauser, D.: Weiße Emitter in OLEDs fr Vollfarbdisplays und Beleuchtungszwecke. Ph.D. Thesis, Technische Universität Bergakademie Freiberg (2007)

    Google Scholar 

  5. Burroughes, J.H., Bradley, D.D.C., Brown, A.R., Marks, R.N., Mackay, K., Friend, R.H., Burns, P.L., Holmes, A.B.: Light-emitting diodes based on conjugated polymers. Nature 347, 539–541, (1990)

    Google Scholar 

  6. Carcia, P.F., McLean, R.S., Groner, M.D., Dameron, A.A., George, S.M.: Gas diffusion ultrabarriers on polymer substrates using \({\rm Al}_2{\rm O}_3\) atomic layer deposition and sin plasma-enhanced chemical vapor deposition. J. Appl. Phys. 106(2), (2009). doi:10.1063/1.3159639

  7. Celler, G.K., Cristoloveanu, S.: Frontier of silicon-on-insulator. J. Appl. Phys. 93(9), (2003). doi:10.1063/1.1558223

  8. Chwang, A.B., Rothman, M.A., Mao, S.Y., Hewitt, R.H., Weaver, M.S., Silvernail, J.A., Rajan, K., Hack, M., Brown, J.J.: Thin film encapsulated flexible organic electroluminescent displays. Appl. Phys. Lett. 83(3), (2003). doi:10.1063/1.1594284

  9. Delo Industrial Adhesives: Technical information Delo-Dualbond LP VE 19487. Technical Report (2006). http://www.delo.de

  10. DisplaySearch: OLED 2009 Revenue Growth Continues, Up 35% Y/Y to $826M, According to DisplaySearch. Austin, Texas (2010, Press Release)

    Google Scholar 

  11. Doerfler, R., Barth, S., Boeffel, C., Wedel, A.: New UV-curing OLED encapsulation adhesive with low water permeation. In: SID 2006 Digest, vol. 37, pp. 440–443. SID (2006). doi:10.1889/1.2433526

  12. Electro-Lite Corporation: Technical data sheet ELC-2500CL. Technical Report (2007). http://www.electro-lite.com

  13. EV Group: IQ-Aligner. Technical Report (2004). http://www.evgroup.com

  14. EV Group: Wafer bonding system EVG500. Technical Report (2007).  

  15. Fehse, K., May, C., Schmidt, C., Vogel, U., Hild, O.R.: Challenges for OLED-on-CMOS process technology. In: SID-ME Chapter Spring Meeting (2010). Poster

    Google Scholar 

  16. Forrest, S.R., Bradley, D., Thompson, M.: Measuring the efficiency of organic light-emitting devices. Adv. Mater. 15(13), 1043–1048 (2003). doi:10.1002/adma.200302151

    Article  CAS  Google Scholar 

  17. Fraunhofer IPMS: Fraunhofer IPMS achieves ‘first light’ with its HYPOLED digital VGA full-color OLED microdisplay, 4 Feb 2010. www.premiumpresse.de. Press release

    Google Scholar 

  18. Friend, R.H., Gymer, R.W., Holmes, A.B., Burroughes, J.H., Marks, R.N., Taliani, C., Bradley, D.D.C., Dos Santos, D.A., Brédas, J.L., Lögdlund, M., Salaneck, W.R.: Electroluminescence in conjugated polymers. Nature 397, (1999). doi:10.1038/16393 (Review)

  19. Geffroy, B., Le Roy, P., Prat, C.: Review-organic light-emitting diode (OLED) technology-materials, devices and display technologies. Polym. Int. 55, 572–582 (2005). doi:10.1002/pi.1974

  20. Ghosh, A.P., Gerenser, L.J., Jarman, C.M., Fornalik, J.E.: Thin-film encapsulation of organic light-emitting devices. Appl. Phys. Lett. 86, (2005). 10.1063/1.1929867 Eastman Kodak Company, 1999 Lake Ave., Rochester, New York 14650

    Google Scholar 

  21. Gil, T.H., May, C., Lakner, H., Leo, K., Keller, S.: Al top cathode deposition on OLED using dc magnetron sputtering. Plasma Processes Polym. 6, (2009). doi:10.1002/ppap.200932105

  22. Gil, T.H., May, C., Scholz, S., Franke, S., Toerker, M., Lakner, H., Leo, K., Keller, S.: Origin of damages in OLED from Al top electrode deposition by dc magnetron sputtering. Org. Electron. 11(2), 322–331 (2010). doi:10.1016/j.orgel.2009.11.011

    Article  CAS  Google Scholar 

  23. Grossmann, C., Dufour, O., Zilstorff Christian; Notni, G.: OLED based projection systems for mobile application. In: SID ME–Chapter Spring Meeting 2010. Dresden (2010)

    Google Scholar 

  24. Habenicht, G.: Kleben, 6th edn. Springer, Berlin (2009)

    Google Scholar 

  25. Haller, W., Onusseit, H., Gierenz, G., Gruber, W., Rich, R.D., Henke, G., Thiele, L., Hoffmann, H., Dausmann, D., Özelli, R.N., Windhvel, U., Sattler, H.P., Dierichs, W., Tauber, G., Hirthammer, M., Matz, C., Holloway, M., Melody, D., Rust, E.U., Halteren, A.v., Picker, S.: Adhesives. Ullmann’s Encyclopedia of Industrial Chemistry 7, Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim (2009). doi:10.1002/14356007.a01_221.pub2

    Google Scholar 

  26. Hung, L.S., Chen, C.H.: Recent progress of molecular organic electroluminescent materials and devices. Mater. Sci. Eng. R 39, 143–222 (2002). doi:10.1016/S0927-796X(02)00093-1

  27. Kim, G.H., Oh, J., Yang, Y.S., Do, L.M., Suh, K.S.: Encapsulation of organic light-emitting devices by means of photopolymerized polyacrylate films. Polymer 45, (2004). doi:10.1016/j.polymer.2004.01.038

  28. Kobrin, P., Fisher, R., Gurrola, A.: Reversible photodegradation of organic light-emitting diodes. Appl. Phys. Lett. 85, 2385–2387 (2004). doi:10.1063/1.1793344

    Google Scholar 

  29. Kreye, D., Toerker, M., Vogel, U., Bunk, G., Grillberger, C., Amelung, J.: Microdisplays with highly efficient small molecules OLEDs. SID-MID-Europe Chapter Spring Meeting–Microdisplays, Applications, and Optics (2008). http://www.scientificcommons.org/38231413. SID-MID-Europe Chapter 2008. CD-ROM: March 13–14, 2008, Jena

  30. Kreye, D., Törker, M., Vogel, U., Amelung, J.: Full colour RGB OLEDs on CMOS for active-matrix OLED microdisplays. Proceedings of SPIE 6333, SPIE (2006). doi:10.1117/12.680758

  31. Kumara, R., Aucha, M., Oua, E., Ewaldb, G., Jina, C.S.: Low moisture permeation measurement through polymer substrates for organic light emitting devices. Thin Solid Films 417, 120–126 (2002)

    Article  Google Scholar 

  32. Lee, Y.G., Choi, Y.H., Kee, I.S., Shim, H.S., Jin, Y., Lee, S., Koh, K.H., Lee, S.: Thin-film encapsulation of top emission organic light-emitting devices with polyurea-\({\rm Al}_2{\rm O}_3\) hybrid multi-layers. Org. Electron. (2009). doi: 10.1016/j.orgel.2009.07.015

    Google Scholar 

  33. Mandlik, P., Gartside, J., Han, L., Cheng, I.C., Wagner, S., Silvernail, J.A., Ma, R.Q., Hack, M., Brown, J.J.: A single-layer permeation barrier for organic light-emitting displays. Appl. Phys. Lett. 92, 2008, doi:10.1063/1.2890432

  34. Mathine, D.L., Woo, H.S., He, W., Kim, T.W., Kippelen, B., Peyghambarian, N.: Heterogeneously integrated organic light-emitting diodes with complementary metal-oxide-silicon circuitry. Appl. Phys. Lett. 76, 3849 (2000). doi:10.1063/1.126798

    Google Scholar 

  35. McCluney, W.R.: Introduction to Radiometry and Photometry. Artech House, Boston (1994). ISBN 978-0-89006-678-2

    Google Scholar 

  36. Meerheim, R., Lüssem, B., Leo, K.: Efficiency and stability of p-i-n type organic light emitting diodes for display and lighting applications. Proc. IEEE 97(9), 1606–1626 (2009). doi:10.1109/JPROC.2009.2022418

    Article  CAS  Google Scholar 

  37. Microemissive Displays: Colour optoelectronic device (2008). Pr.: GB 0622998.3, 17.11.2006

    Google Scholar 

  38. Mirza, A.R.: One micron precision, wafer-level aligned bonding for interconnect, mems and packaging applications. In: Electronic Components and Technology Conference, pp. 676–680. Electronic Visions, Inc. (2000)

    Google Scholar 

  39. Nagase Chemtex: Technical information sheet UV Resin XNR5541. Technical Report (2006). www.nagasechemtex.co.jp

    Google Scholar 

  40. Niklaus, F., Enoksson, P., Klvesten, E., Stemme, G.: A method to maintain wafer alignment precision during adhesive wafer bonding. Sens. Actuators A 107, (2003). doi:10.1016/S0924-4247(03)00356-X

  41. Niklaus, F., Stemme, G., Lu, J.Q., Gutmann, R.J.: Adhesive wafer bonding. J. Appl. Phys. 99, 031101 (2006). doi:10.1063/1.2168512

    Google Scholar 

  42. Pham, H.Q., Marks, M.J.: Epoxy resins. Ullmann’s Encyclopedia of Industrial Chemistry 7, Wiley-VCH Verlag GmbH& Co. KGaA, Weinheim (2005). doi:10.1002/14356007.a09

  43. Pham, N.P., Burghartz, J.N., Sarro, P.M.: Spray coating of photoresist for pattern transfer on high topography surfaces. J. Micromech. Microeng. 15, 691–697 (2005). doi:10.1088/0960-1317/15/4/003

    Google Scholar 

  44. Reckziegel, S., Kreye, D., Puegner, T., Grillberger, C., Toerker, M., Vogel, U.: Optoelectronic chips integrate emitters and sensors. SPIE (2008). doi:10.1117/2.1200806.1151 SPIE Newsroom

  45. Star Technology: Product bulletin L-75-1. Technical report (2009). http://www.star-technology.com

  46. Süss MicroTec: Laboratory mask aligner MA8. Technical report (2006). http://www.suss.com

  47. Süss MicroTec: Manual wafer bonder SB6L. Technical report (2008). http://www.suss.com

  48. Tang, C.W., Van Slyke, S.A.: Organic electroluminescent diodes. Appl. Phys. Lett. 51, (1987)

    Google Scholar 

  49. Toerker, M., Grillberger, C., Kreye, D., Vogel, U., Amelung, J.: Integration of top-emitting organic light emitting diodes on CMOS substrates. In: Paul L. Heremans, Michele Muccini, Eric A. Meulenkamp (eds.) Organic Optoelectronics and Photonics III, Proceedings of SPIE 6999, doi:10.1117/12.781076 Strasbourg, France (2008)

  50. Vogel, U., Kreye, D., Reckziegel, S., Törker, M., Grillberger, C., Amelung, J.: OLED-on-CMOS integration for optoelectronic sensor applications. Proceedings of SPIE 6477, SPIE (2007)

    Google Scholar 

  51. Vogel, U., Kreye, D., Richter, B., Bunk, G., Reckziegel, S., Herold, R., Scholles, M., Toerker, M., Grillberger, C., Amelung, J., Graupner, S.T., Pannasch, S., Heubner, M., Velichkovsky, B.: Bi-directional OLED microdisplay for interactive HMD. In: SID International Symposium 2008, vol. XXXIX, pp. 81–84. Society for Information Display (SID International Symposium) (2008)

    Google Scholar 

  52. Walzer, K., Maennig, B., Pfeiffer, M., Leo, K.: Highly efficient organic devices based on electrically doped transport layers. Chem. Rev. 107(4), (2007). doi:10.1021/cr050156n

  53. Wang, X.Z., Gao, X.D., Zhou, Y.C., Xie, Z.T., Song, Q.L., Ding, X.M., Hou, X.Y.: Photodegradation of organic light-emitting devices observed in nitrogen-filled environment. Thin Solid Films 516, 2171–2174 (2008). doi:10.1016/j.tsf.2007.06.141

    Google Scholar 

  54. Wang, Y.Y., Hsieh, T.E., Chen, I.C., Chen, C.H.: Direct encapsulation of organic light-emitting devices (OLEDs) using photo-curable co-polyacrylate/silica nanocomposite resin. IEEE Trans. Adv. Packag. 30(3), (2007). http://ieeexplore.ieee.org/iel5/6040/4285919/04285953.pdf

  55. Yacobi, B.G., Martin, S., Davis, K., Hudson, K., Hubert, M.: Adhesive bonding in microelectronics and photonics. J. Appl. Phys. 91(10), (2002). doi:10.1063/1.1467950 (Review)

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Authors and Affiliations

  1. Fraunhofer Institute for Photonic Microsystems (IPMS), Maria-Reiche-Str.2, 01109, Dresden, Germany

    Christian Schmidt

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Correspondence to Christian Schmidt .

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  1. Fak. Elektrotechnik, Inst. Festkörperelektronik, TU Dresden, Helmholtzstr. 18, Dresden, 01069, Sachsen, Germany

    Gerald Gerlach

  2. Fak. Elektrotechnik und, Informationstechnik, TU Dresden, Mommsenstr. 13, Dresden, 01069, Sachsen, Germany

    Klaus-Jürgen Wolter

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Schmidt, C. (2012). Direct Encapsulation of OLED on CMOS. In: Gerlach, G., Wolter, KJ. (eds) Bio and Nano Packaging Techniques for Electron Devices. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-28522-6_29

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