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Self-Assembly of Nanowire-Based Field-Effect Transistors

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Bio and Nano Packaging Techniques for Electron Devices

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Abstract

Due to their superior electronic properties, carbon nanotubes are considered as specific candidates for future nanoelectronics. In this chapter we demonstrate that carbon nanotube-based field-effect transistors with an excellent electrical performance can be assembled bottom-up by applying alternating-current dielectrophoresis which constitutes a huge step forward into the direction of application of carbon nanotubes. Dielectrophoresis is known as a versatile tool for the manipulation of suspended particles in electrical fields. Here we use dielectrophoresis for various tasks related to the development of self-assembly strategies for the fabrication of carbon nanotube-based field-effect transistors: (1) Assembly of interconnects in a very controlled manner, (2) sorting of carbon nanotubes according to their electronic type and (3) reduction of the high contact resistance between the electrodes and the CNT by applying a second dielectrophoresis step with aqueous metal salt solutions.

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Authors and Affiliations

  1. Professur für Physikalische Chemie, Mess- und Sensortechnik, Technische Universität Dresden, 01062, Dresden, Germany

    Juliane Posseckardt & Michael Mertig

  2. Kurt-Schwabe-Institut für Mess- und Sensortechnik e.V. Meinsberg, Kurt-Schwabe-Str. 4, 04720, Ziegra-Knobelsdorf, Germany

    Juliane Posseckardt & Michael Mertig

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  1. Juliane Posseckardt
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  2. Michael Mertig
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Correspondence to Michael Mertig .

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Editors and Affiliations

  1. Fak. Elektrotechnik, Inst. Festkörperelektronik, TU Dresden, Helmholtzstr. 18, Dresden, 01069, Sachsen, Germany

    Gerald Gerlach

  2. Fak. Elektrotechnik und, Informationstechnik, TU Dresden, Mommsenstr. 13, Dresden, 01069, Sachsen, Germany

    Klaus-Jürgen Wolter

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Posseckardt, J., Mertig, M. (2012). Self-Assembly of Nanowire-Based Field-Effect Transistors. In: Gerlach, G., Wolter, KJ. (eds) Bio and Nano Packaging Techniques for Electron Devices. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-28522-6_16

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