Precisely Assembled Multi Deflection Arrays – Key Components for Multi Shaped Beam Lithography

  • Matthias Mohaupt
  • Erik Beckert
  • Thomas Burkhardt
  • Marcel Hornaff
  • Christoph Damm
  • Ramona Eberhardt
  • Andreas Tünnermann
  • Hans-Joachim Döring
  • Klaus Reimer
Part of the IFIP Advances in Information and Communication Technology book series (IFIPAICT, volume 371)

Abstract

Multi shaped beam lithography requires the precise and durable alignment and fixation of MEMS based Multi Deflection Arrays on stable ceramic system platforms using vacuum and high temperature compatible interconnection and joining technologies. Micron accuracy during assembly is accomplished by mark detection using image processing and 3DOF alignment procedures; while interconnection as well as precise fixation is carried out using a fine pitch solder bumping process. Qualification investigations using electron beam equipment show that the precisely aligned multi shaped beam arrays are able to deflect the electron beams in accordance with the simulation results.

Keywords

multi shaped beam lithography multi deflection array MEMS assembly precision alignment 

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Copyright information

© IFIP International Federation for Information Processing 2012

Authors and Affiliations

  • Matthias Mohaupt
    • 1
  • Erik Beckert
    • 1
  • Thomas Burkhardt
    • 1
  • Marcel Hornaff
    • 1
  • Christoph Damm
    • 1
  • Ramona Eberhardt
    • 1
  • Andreas Tünnermann
    • 1
  • Hans-Joachim Döring
    • 2
  • Klaus Reimer
    • 3
  1. 1.Fraunhofer Institute for Applied Optics and Precision Engineering IOFJenaGermany
  2. 2.Vistec Electron Beam GmbHJenaGermany
  3. 3.Fraunhofer Institute for Silicon Technology ISITItzehoeGermany

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