Processes for the Self-assembly of Micro Parts

  • Matthias Burgard
  • Norbert Schläfli
  • Uwe Mai
Part of the IFIP Advances in Information and Communication Technology book series (IFIPAICT, volume 371)


The following approach of a fluidic based self-assembly process uses the surface forces for a precise handling and positioning of small devices for a roll-to-roll manufacturing. The surface, on which the device should be positioned, will be functionalized with hydrophile and hydrophobic areas. Thus water droplets can be caught on the hydrophile areas. The devices to be positioned will be placed on these droplets and due to the surface tension moved to their final position. The droplets, a solution of ultrapure water and isopropanol, are evaporating residue-free within seconds [1].


handling automation manufacturing assembly self-assembly surface tension fluid roll-to-roll 


  1. 1.
    Boufercha, N., Sägebarth, J., Othman, N., Burgard, M., Schäfer, W., Sandmaier, H.: Selfassembly of Micro Components with Microfluidics. In: Proceedings of the International Workshop on Micro- and Nano- Technologies and Systems, Moskau, pp. 45–52 (2007)Google Scholar
  2. 2.
    Hecker, K.: Organic and Printed Electronics, 3rd edn. VDMA Verlag GmbH, Frankfurt am Main (2009)Google Scholar
  3. 3.
    Gourlay, J., et al.: Light-Rolls: High throughput manufacture for LED Lighting and Displays. Display Week 2010, SID International Symposium, Society for Information Display, 2010 - Digest of Technical Papers (2010) 20110104283Google Scholar
  4. 4.
  5. 5.
    Morris, C.J., Stauth, S.A., Parviz, B.A.: Self-Assembly for Microscale and Nanoscale Packaging: Steps Toward Self-Packaging. IEE Transactions on Advanced Packaging 28(4), 600–611 (2005)CrossRefGoogle Scholar
  6. 6.
    Boufercha, N., Schäfer, W., Sägebarth, J., Sandmaier, H.: Influences of Nanostructured Interfaces on Microfluidics. In: NNT International Conference on Nanoprint & Nanoimprint Technology (2007)Google Scholar
  7. 7.
    Fang, J., Böhringer, K.F.: Wafer-Level Packaging Based on Uniquely Orienting Self-Assembly (The DUO-SPASS Process). Journal of Microelectromechanical Systems 15(3) (June 2006)Google Scholar
  8. 8.
    Yeh, H.J., Smith, J.S.: Fluidic Slef-Assembly for the Integration of GaAs Light-Emitting Diodes on Si Substrates. IEEE Photonics Technology Letters 6(6) (June 1994)Google Scholar
  9. 9.
    Schlenker, D.: Schließventillösung für unterschiedlichste Anwendungen. adhäsion KLEBEN & DICHTEN, 16–18 (November 2010) Google Scholar

Copyright information

© IFIP International Federation for Information Processing 2012

Authors and Affiliations

  • Matthias Burgard
    • 1
  • Norbert Schläfli
    • 2
  • Uwe Mai
    • 1
  1. 1.Fraunhofer Institute for Manufacturing Engineering and AutomationStuttgartGermany
  2. 2.Norbert SchläfliMaschinenZofingenSwitzerland

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