Abstract
Packaging is one of the major cost drivers for MEMS devices. Currently wire bonding is the dominant method for electrically connecting MEMS chips to substrate. Using self-alignment a method for packaging multiple MEMS at the same time has been developed. The presented process achieves high throughput and precise alignment at low cost. The Controlled Collapse Re-flow Chip Joining (C-4) process has been adapted to the specific requirements of MEMS. The combination of coarse robotics and liquid solder self-alignment guarantees precise positioning and alignment of the individual MEMS chips to the respective substrates. The new method has been implemented in a case study. In the study force sensors have been packaged. Precise angular alignment of the sensors is critical for receiving accurate measurements. Results of the case study are presented.
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Taprogge, J., Beyeler, F., Steinecker, A., Nelson, B.J. (2012). Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment. In: Ratchev, S. (eds) Precision Assembly Technologies and Systems. IPAS 2012. IFIP Advances in Information and Communication Technology, vol 371. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-28163-1_4
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DOI: https://doi.org/10.1007/978-3-642-28163-1_4
Publisher Name: Springer, Berlin, Heidelberg
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