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Research and Development of Portable Data Acquisition System Based on the OMAP-L138

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Mechanical Engineering and Technology

Part of the book series: Advances in Intelligent and Soft Computing ((AINSC,volume 125))

Abstract

The OMAP-L138 processor of TI has the characteristics of high-performance, small size and low-power consumption, it is widely applied to the development of portable device. In order to obtain the best performance of microprocessor, communication between ARM side and DSP side becomes the key problem of the application of system development. The development method of portable data acquisition system based on the OMAP-L138 platform is studied in this paper. Dual-core communication program based on DSP/BIOS Link is designed in paper makes the collected data can be transmitted to the ARM side and the data can be used to real-time display of waveform and a new solution for developing portable data acquisition analysis system is put forward in this paper.

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References

  1. Peng, Q., Yang, L., Pan, Y.: Open Multimedia Application Platform-The Principle and Application of OMAP Processor, pp. 1–3. Publish House of Electronics Industry, Beijing (2005)

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  2. Texas Instruments. OMAP-L138 Applications Processor System Reference Guide (2010), http://focus.ti.com/lit/ug/sprugm7d/sprugm7d.pdf

  3. Texas Instruments. DSP/BIOS Link User’s Guide (2010), http://software-dl.ti.com/dsps/dsps_public_sw/sdo_sb/targetcontent/DSPLink/1_63/index_FDS.html

  4. Texas Instruments. DSP/BIOS Link Installation Guide (2010), http://software-dl.ti.com/dsps/dsps_public_sw/sdo_sb/targetcontent/DSPLink/1_63/index_FDS.html

  5. Texas Instruments. TMS320 DSP/BIOS v5.41 User’s Guide (2009), http://focus.ti.com.cn/cn/general/docs/litabsmultiplefilelist.tsp?literatureNumber=spru423h

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Correspondence to Qing Zhu .

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© 2012 Springer-Verlag GmbH Berlin Heidelberg

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Zhu, Q., Xu, F. (2012). Research and Development of Portable Data Acquisition System Based on the OMAP-L138. In: Zhang, T. (eds) Mechanical Engineering and Technology. Advances in Intelligent and Soft Computing, vol 125. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-27329-2_26

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  • DOI: https://doi.org/10.1007/978-3-642-27329-2_26

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-27328-5

  • Online ISBN: 978-3-642-27329-2

  • eBook Packages: EngineeringEngineering (R0)

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