Sub-Surface Microstructural Analysis

  • Werner Österle


Many performance properties of devices or interacting machine parts are related to superficial layers which often show completely different or at least modified microstructures compared to the bulk materials. A quasi non-destructive technique will be described which enables us to obtain detailed information of a material’s state at a certain site of interest down to a depth of 10 μm from the surface with nanometre or even atomistic resolution.


Select Area Electron Diffraction Solid Lubricant Diamond Coating Incipient Melting Nanocrystalline Diamond 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.



Hydrogenated amorphous carbon


Auger electron spectroscopy


Coefficient of friction


Chemical vapour deposition


Electron back scattering diffraction


Energy dispersive X-ray spectroscopy


Electron energy loss spectroscopy


Energy-filtered transmission electron microscopy


European Metrology Research Program


Focused ion beam


High-angle annular dark field


High-resolution transmission electron microscopy


Ion-beam-induced chemical vapour deposition


Light optical microscopy


Movable cellular automata


Mechanically mixed layer


Physical vapour deposition


Selected area electron diffraction


Scanning electron microscopy


Scanning transmission electron microscopy


tetragonal amorphous carbon


Transmission electron spectroscopy


X-ray photoelectron spectroscopy


Atomic number


Government funding of small- and medium-sized enterprises (Zentrales Investitionsprogramm Mittelstand)



The examples shown in our case studies refer to funded research projects listed here in the order of appearance in the text: OS77/13-2 (German Research Foundation), ZIM-DiaKun (Federal Ministry of Commerce), AiF-15983 BG (Federal Ministry of Commerce), OS77/14-1 (German Research Foundation), Siemens AG Berlin, UHPC (BAM Innovationsoffensive 2008).

Furthermore, technical assistance from the following colleagues is gratefully acknowledged: Illona Dörfel (TEM), Wolfgang Gesatzke (FIB), Claudia Prietzel (TEM), Romeo Saliwan Neumann (SEM) and Heidi Rooch (FIB).


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Copyright information

© Springer-Verlag Berlin Heidelberg 2013

Authors and Affiliations

  1. 1.Bundesanstalt für Materialforschung und—prüfungBerlinGermany

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