From Chip Design to the Optimum Package

  • Ulrich H. P. Fischer-Hirchert


In this chapter, the construction way of mechanical and optical design of photonic modules is described in detail. First, an overview of the general requirements of photonic packaging techniques is given followed by an exact example of the mechanical design of a laser module, which is shown in Chap.  11. Afterward, several optical simulation tools are described, which are important to apply for the fiber–chip coupling and the design of the waveguides on an optoelectronic integrated chip (OEIC).


Simulation Program Element Type Peltier Element Polymer Optical Fiber Surface Editor 
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Copyright information

© Springer-Verlag Berlin Heidelberg 2015

Authors and Affiliations

  1. 1.Photonic Communications LabHarz University of Applied SciencesWernigerodeGermany

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