Optical Motherboard

  • Ulrich H. P. Fischer-Hirchert
  • Ulrich Krzysztof Nieweglowski
Chapter

Abstract

In this chapter, the hybrid integration of optoelectronic components on a suitable substrate such as silicon, ceramic, glass, or PCB is set out in detail. So far, this technology is succeeded only in approaches to produce a wide range of applications with this technology. The large number of additional technologies such as flip chip technology, vapor deposition , and silica etching makes the production of complex component groups very expensive and complex. A potential approach to lower the complexity and hence the fabrication costs is the integration of optics into printed circuit boards. The key for wide adoption of optics on board-level is the development of compatible processes for integration and assembly. The chapter addresses these developments and shows the supremacy of PCB-integrated optics for applications where high energy efficiency and bandwidth density are particularly in demand.

Keywords

Optical Coupling Optical Interconnect Waveguide Core Indirect Coupling Polymer Waveguide 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer-Verlag Berlin Heidelberg 2015

Authors and Affiliations

  • Ulrich H. P. Fischer-Hirchert
    • 1
  • Ulrich Krzysztof Nieweglowski
    • 2
  1. 1.Photonic Communications LabHarz University of Applied SciencesWernigerodeGermany
  2. 2.Electronics Packaging LaboratoryDresden University of TechnologyDresdenGermany

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