OBC Mechanical Design

  • Jens Eickhoff
Part of the Springer Aerospace Technology book series (SAT)


The mechanical design of an OBC in the first place seems a rather simple task compared to the electronics. However it has to fulfill a number of non trivial requirements and may not be underestimated. Not only the interconnection between OBC PCBs and OBC housing but also the entire assembly of the OBC has to withstand

  • sine vibration and shock loads during launch and

  • permanent temperature cycles (and resulting mechanical implications) in orbit.

First of all the chips are mounted with according soldering connections onto the boards. The most common designs used are “Surface Mounted Devices”, (SMD), or chip implementation as “Ball Grid Array”, (BGA), assemblies respectively.


Shock Load Ball Grid Array Electromagnetic Emission Mechanical Implication Flexible Wiring 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Copyright information

© Springer-Verlag Berlin Heidelberg 2012

Authors and Affiliations

  • Jens Eickhoff

    There are no affiliations available

    Personalised recommendations