OBC Mechanical Design
The mechanical design of an OBC in the first place seems a rather simple task compared to the electronics. However it has to fulfill a number of non trivial requirements and may not be underestimated. Not only the interconnection between OBC PCBs and OBC housing but also the entire assembly of the OBC has to withstand
sine vibration and shock loads during launch and
permanent temperature cycles (and resulting mechanical implications) in orbit.
First of all the chips are mounted with according soldering connections onto the boards. The most common designs used are “Surface Mounted Devices”, (SMD), or chip implementation as “Ball Grid Array”, (BGA), assemblies respectively.
KeywordsShock Load Ball Grid Array Electromagnetic Emission Mechanical Implication Flexible Wiring
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