Advertisement

Mechatronics pp 759-767 | Cite as

Multi-channel Laser Interferometer for Parallel Characterization of MEMS Microstructures

  • K. Liżewski
  • A. Styk
  • M. Józwik
  • M. Kujawińska
  • R. Paris
  • S. Beer
Conference paper

Abstract

In the paper the new approach towards microsystems characterization at wafer level, developed under EU project “SMART InspEction system for High Speed and multifunctional testing of MEMS and MOEMS” (SMARTIEHS) is presented. The goal of the project is to provide fast, cost effective and flexible optical inspection system. Two different interferometer approaches are pursued in the project’s development process: a refractive optics based Mirau type low coherence interferometer and a diffractive optics based Twyman-Green laser interferometer. In the paper the design and the tests of the laser interferometer are presented. The multifunctional approach of the interferometer measurement concept allows inspecting MEMS shape and deformation as well as characterizing spatial distribution of vibration amplitude at a resonance frequency within one instrument.

Keywords

Inspection System Feed Forward Control Laser Interferometer Leaf Spring Optical Path Difference 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. 1.
    NEXUS MST/MEMS Market Analysis III 2005-2009 report (2009)Google Scholar
  2. 2.
    Osten, W. (ed.): Optical inspection of Microsystems. Taylor and Francis, New York (2006)Google Scholar
  3. 3.
    SMARTIEHS - SMART InspEction system for High Speed and multifunctional testing of MEMS and MOEMS, www.ict-smartiehs.eu
  4. 4.
    Cascade Microtech, Inc., http://www.cmicro.com/
  5. 5.
    Beer, S.: Real-time photon-noise limited optical coherence tomography based on pixel-level analog signal processing, PhD dissertation, University of Neuchâtel, Neuchâtel (2006)Google Scholar
  6. 6.
    Styk, A., Lambelet, P., Røyset, A., et al.: SPIE, vol. 7387, p. 73870M (2010)Google Scholar

Copyright information

© Springer-Verlag Berlin Heidelberg 2011

Authors and Affiliations

  • K. Liżewski
    • 1
  • A. Styk
    • 1
  • M. Józwik
    • 1
  • M. Kujawińska
    • 1
  • R. Paris
    • 2
  • S. Beer
    • 3
  1. 1.Institute of Micromechanics and PhotonicsWarsaw University of TechnologyWarsawPoland
  2. 2.Institut für Mikroelektronik- und Mechatronik-Systeme Gemeinnützige GmbHIlmenauGermany
  3. 3.CSEMZürichSwitzerland

Personalised recommendations