Abstract
The technology of vertical integration using Through Silicon Vias (TSVs) now is mature for commercial products with a smaller form factor, better performance, less power consumption and lower cost. This paper addresses two challenges faced with the design using vertical integration. First, methods for the characterization of the physical behavior of the new interconnect structures are described. Second, since issues of reliability and thermal management become more important and difficult and the design space is drastically larger, new early stage design tools are needed. A new floorplanning flow is introduced which supports the cost and performance optimized implementation of digital systems in a stack.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Limansyah I, Wolf MJ, Klumpp A, Zoschke K, Wieland R, Klein M, Oppermann H, Nebrich L, Heinig A, Pechlaner A, Reichl H, Weber W (2009) 3d image sensor sip with tsv silicon interposer, ECTC 2009, San Diego
Karnik T (2010) 3d architectures and cad tools, D43D Workshop, Lausanne
Schneider P, Elst G (2008) Modeling approaches and design methods for 3D system design. In: Garrou P (ed) Handbook of 3D integration, vol 2, Technology and applications of 3D integrated circuits, Wiley-VCH, Weinheim, pp 529–574
Elst G, Schneider P, Ramm P (2006) Modeling and Simulation of Parasitic Effects in Stacked Silicon. Proc. 2006 MRS Fall Meeting, November 27–December 1, Boston
Karypis G, Aggarwal R, Kumar V, Shekhar S (1997) Multilevel hypergraph partitioning: Applications in vlsi domain, 34th Design and Automation Conference, pp 526–529
Schneider P, Heinig A, Fischbach R, Lienig J, Reitz S, Stolle J, Wilde A (2010) Integration of multi physics modeling of 3D stacks into modern 3D data structures. 2nd IEEE International 3D System Integration Conference, 3DIC
Heinig A, Schuster T (2011) A 3d stack cost optimization floorplanning and routing approach, DATE Workshop for 3D Integration, Grenoble
Author information
Authors and Affiliations
Corresponding authors
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2011 Springer-Verlag Berlin Heidelberg
About this chapter
Cite this chapter
Knoechel, U., Heinig, A., Stolle, J., Reitz, S., Wilde, A. (2011). Electronic Design Automation for Implementation of 3D Integrated Systems. In: Heuberger, A., Elst, G., Hanke, R. (eds) Microelectronic Systems. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-23071-4_3
Download citation
DOI: https://doi.org/10.1007/978-3-642-23071-4_3
Published:
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-23070-7
Online ISBN: 978-3-642-23071-4
eBook Packages: Computer ScienceComputer Science (R0)