Abstract
In order to introduce the analysis model basing on the actual situation of production to study the temperature change of mould, the mould and the spraying process were simplified. The distributions of temperature in the surface and different distances from the surface were studied in spraying conditions by the finite element analysis. The results showed that in the course of spraying, the surface temperature would decline sharply, but the inner temperature didn’t change significantly. After three model comparisons, a 2D simple model was adopted to carry out the temperature change analysis, and the results were credible.
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References
Arif, A.F.M., Sheikh, A.K., Qamar, S.Z.: A study of die failure mechanisms in aluminum extrusion. J. Mater. Process. Technol. 134, 318–328 (2003)
Hu, X., Zhao, G., Wu, B.: Temperature change and stress distribution analysis of die surface in Al-alloy die casting process and experimental study on die heat check. China Foundry 5, 47–53 (2008)
Prosenjit, S., Vijay, B., Tata, R.: Thermal structural analysis of SST-1 vacuum vessel and cryostat assembly using ANSYS. Fusion Engineering and Design 84, 7–11 (2009)
Hyder, M.J., Asif, M.: Optimization of location and size of opening in a pressure vessel cylinder using ANSYS. Engineering Failure Analysis 15, 1–19 (2008)
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© 2011 Springer-Verlag Berlin Heidelberg
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Hu, X., Zhang, J. (2011). Finite Element Analysis of Mould Temperature Change When Releasing Agent Sprayed. In: Zhou, M., Tan, H. (eds) Advances in Computer Science and Education Applications. Communications in Computer and Information Science, vol 202. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-22456-0_38
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DOI: https://doi.org/10.1007/978-3-642-22456-0_38
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-22455-3
Online ISBN: 978-3-642-22456-0
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